Hitachi Chemical Company, Ltd.

Touichi Sakata

Hiroshi Nishizawa

Yoshiyuki Mukoyama

Toshiaki Tanaka

Yoshii Morishita

Hidekazu Matsuura

Masaaki Yasuda

Yoshihiro Nomura

Aizou Kaneda

Yasuhiro Yano

Kenji Suzuki

Yuichi Osada

Keizo Hirai

There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.

Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same

Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof

A thermoresistance adhesive which does not dissolve in the sealer-composing resins at the sealer molding temperature and is capable of providing a semiconductor chip/lead frame adhesive strength under shear of 1 N/4 mm or greater, and including, for example, amide, imide, ester or ether linkage is suited for use in producing thermoresistance adhesive solutions and thermoresistance resin pastes, and the semiconductor chips, lead frames, films, etc., made by using such an adhesive are suited for providing low-cost semiconductor devices.

Thermoresistance adhesive and semiconductor device using the same

A polyetheramide-imide polymer composition comprising an aromatic polyetheramide-imide polymer obtained by reacting trimellitic acid or a derivative thereof with a special aromatic diamine having ether linkages, and an ether compound and/or an alicyclic ketone compound as a solvent is excellent in film-forming properties at low temperatures.

Polyetheramide-imide polymer composition

A polyamide-imide resin composition comprising (A) a polyamide-imide resin modified with a polyisocyanate containing one or more isocyanurate rings and a lactam and (B) at least one member selected from the group consisting of (i) an alkoxy modified amino resin, (ii) a polyisocyanate containing one or more isocyanurate rings, (iii) a phenol-formaldehyde resin, (iv) an epoxy resin, (v) a polyester resin having one or more hydroxyl groups obtained by using terephthalic acid and/or isophthalic acid as an acid component, and (vi) a metal salt of Sn, Mn, Co or Zn, can give fast curing properties to the resin composition without lowering heat resistance, flexibility, abrasion resistance and also giving good surface appearance to the coating.

Polyamide-imide resin composition

A polyamide-imide resin obtained by reacting in a cresol type solvent a polyisocyanate containing isocyanurate rings, an aromatic diisocyanate, a lactam and a polycarboxylic acid containing at least one acid anhydride group, said polyisocyanate being used in an amount of 1 to 30 equivalent % and said lactam in an amount of 20 to 80 equivalent % each based on the total isocyanate equivalent can give a resin composition or a varnish suitable for coating, particularly for producing insulated wire excellent in heat resistance, flexibility, resistance to Freon, wear resistance, and the like.

Polyamide-imide resin and its production

Growing community of inventors

Hitachinaka, Japan

Touichi Sakata