Toyobo Co., Ltd.

Toshiyuki Tsuchiya

Tetsuo Okuyama

Naoki Watanabe

Masahiro Yamashita

Satoshi Maeda

Kaya Tokuda

Kazuyuki Ouya

Shota Hara

Katsuki Nakase

Masahiro Tamada

Shunsuke Ichimura

Issei Kobayashi

The invention provides a laminate including a polyimide film and an inorganic substrate, which has a number density of blisters including carbide particles therein of/mor less, an average height of blisters of 2 μm or less, a product of the number density of the blisters (blisters/m) and the average height of the blisters (μm) of 20 or less. The inventive laminate can be obtained by laminating the polyimide film and the inorganic substrate after sufficiently purifying and cleaning to remove foreign bodies made of inorganic substance therefrom, followed by heat treating the laminate at a temperature of 350-600° C. and then rapidly cooling it to carbonize and reduce the organic foreign bodies, and also to rapidly cool the gas contained in the blisters, which leads to reduced height of blisters.

Laminate of polyimide film and inorganic substrate

The purpose of the present invention is to provide a storage state in which a reactive compound layer can be stably maintained in a polymer film having a reactive compound layer on the surface. The film roll is obtained by winding together: a first polymer film having a reactive compound layer on the surface, and a second polymer film having a surface roughness (Ra) of 0.1 &#x3bc;m or more and a modulus of elasticity of 300 MPa or more and 10 GPa or less. The film bundle is obtained by laminating the first and second polymer films. Preferably, storing the film roll and the film bundle at a low temperature enables a thin layer of a reactive compound to be stably maintained.

Film roll and film bundle

[Problem] To provide a polyimide film laminated substrate in which stable peeling with a constant low force from an inorganic substrate is enabled when a polyimide film is to be peeled from an inorganic substrate even after heat treatment at a temperature exceeding 500&#xb0; C. is performed. [Solution] Silane coupling agent treatment is performed on an inorganic substrate on which a thin film of an aluminum oxide, a thin film of a composite oxide of aluminum and silicon, a thin film of molybdenum or tungsten, or an alloy thin film of molybdenum and tungsten is formed continuously or discontinuously on a part of at least one surface thereof, and a polyimide film layer is further laminated on the silane coupling agent layer. In the obtained laminate, the part where the aluminum oxide thin film layer is present functions as an easily-peelable layer, the part where no aluminum oxide thin film layer functions as an easily-bondable part. The bonding strength of the easily-peelable part does not change even after heat treatment at 500&#xb0; C. or more, and the low value is stably maintained.

Polymer film laminated substrate and method for producing flexible electronic device

A laminate mainly made of polyimide with low thermal expansion, high mechanical strength, and high heat resistance, and a method for manufacturing the same are provided. A surface of a polyimide film is activated and then treated by a silane coupling agent. Subsequently, the obtained silane coupling agent-treated polyimide films are superimposed, and pressure and heat are applied to the superimposed polyimide films so as to manufacture a polyimide film laminate. The obtained polyimide film laminate has a cross-sectional structure of superimposing polyimide film layers and silane coupling agent condensate layer(s) alternately to each other. Adhesive strength between the polyimide films of the polyimide film laminate of the present invention does not change largely from initial adhesive strength even after heat treatment at 400&#xb0; C. for 15 minutes. Further, the polyimide film laminate exhibits a high bending elastic modulus and impact resistance.

Polyimide film layered body

It is provided that a polymer film; a preparation method of the polymer film; and a laminated body used the polymer film. The polymer film is suitable for use in producing a laminate body which comprises a support and a polymer film, and is reduced in foreign-matter trapping and which can be used for supplying film devices using conventional apparatuses for glass substrates or silicon substrates. The polymer film coated with the layer of silane coupling agent, which is suitable for producing a laminate that comprises a support and a polymer film, comprises a silane coupling agent layer formed on at least one surface of the polymer film, wherein the silane coupling agent layer has a three-dimensional surface roughness (Sa) of 5.0 nm or less. The method of efficient for producing the polymer film coated with the above layer is the method for producing without using a vacuum.

Polymer film coated with a layer of silane coupling agent

By preparing a polyimide film with a face at the support side and subjected to a surface treatment; subjecting at least one of a face of the support and the face of the polyimide film which are opposite to each other to a patterning treatment using a coupling agent to form a satisfactorily bondable part and an easily releasable part which differ in adhesion/peel strength; subsequently, superposing the support and the polyimide film to be subjected to a pressurizing/heating treatment and to be bonded to each other, subjecting the surface of the polyimide film to an organic alkali treatment; and then, applying a polyamic acid solution free from a slip agent ingredient, drying the coating film and imidizing the film, a layered product having a structure of at least three layers in which at least one layer contains a slip agent material and both surface layers have no slip agent material is produced.

Method for producing layered product, layered product, method for producing layered product with device using said layered product, and layered product with device

The invention provides a laminate of an inorganic layer, a resin layer, and a coupling agent treatment layer interposed therebetween, which different delamination strengths between the inorganic layer and the resin layer to form a prescribed pattern. The invention also provides a production method comprising (1) treating an inorganic layer with a coupling agent; (2) performing a patterning process to form strong adhesion sections and easily separated sections; and (3) forming a resin layer by drying and heat-treating a coated solution layer obtained by coating a resin solution or a resin precursor solution onto the surface of the inorganic layer that was treated with a coupling agent and then patterned.

Laminate, production method for same, and method of creating device structure using laminate

The invention provides a laminate of a substrate, a polyimide film, and a coupling treatment layer interposed therebetween, which provides different delamination strengths between the substrate and the polyimide film to form a prescribed pattern. The invention also provides a method for producing such a laminate formed from at least a substrate and a polyimide film, whereby, using a film obtained by plasma treatment of at least the surface facing the substrate as the polyimide film, coupling agent treatment is performed on at least one of the surfaces facing the substrate and the polyimide film to form a coupling treatment layer, deactivation treatment is performed on a portion of the coupling treatment layer to form a pre-determined pattern, and then pressing and heating are performed with the substrate and polyimide film overlapping.

Growing community of inventors

Otsu, Japan

Toshiyuki Tsuchiya