Sanyo Electric Co., Ltd.

Toshiyuki Take

Isao Ochiai

Tetsuya Fukushima

Tsutomu Ishikawa

Masashi Arai

Hiroshi Inoguchi

Satoru Sekiguchi

Kiyoshi Takada

Hiroki Seyama

Hiroshi Kobori

Hideo Kunii

A semiconductor device () can include, e.g., a recessed portion () on the reverse surface () of an insulating resin () which is the mounting surface of the semiconductor device (). Additionally, on the outer peripheral surface of the recessed portion (), the exposed region of leads () and the reverse surface () of the insulating resin () form generally the same plane. This allows, e.g., a QFN semiconductor device () according to preferred embodiments herein to place dust particles in the recessed portion () even in the presence of dust particles such as crushed burr particles of the leads () or plastic burrs, thereby avoiding mounting deficiencies when mounting the semiconductor device.

Semiconductor device and method for manufacturing the same

A mold,for molding semiconductor chips,and,serving as a light emitting element and a light receiving element, respectively, is made of a material capable of transmitting light. A groove,is formed on the region where light is emitted from and incident on the semiconductor chips so that it constitutes a reflecting face. Thus, the light is emitted and incident through the side E of the mold. In this configuration, the outer size of the light receiving element or light emitting element can be minimized, and the module provided with these semiconductor chips can also be miniaturized.

Optical semiconductor device and optical semiconductor module equipped with the same

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Gunma, Japan

Toshiyuki Take