Panasonic Intellectual Property Management Co., Ltd.

Toshiyuki Takasaki

Shogo Okita

Atsushi Harikai

Akihiro Itou

Yoshiyuki Wada

Toshihiro Wada

Hidefumi Saeki

Naoaki Takeda

Takahiro Miyai

Ryota Furukawa

The element chip manufacturing method includes: a preparing process of preparing a substrateincluding a plurality of element regions EA and a dividing region DA, the substratehaving a first principal surfaceX and a second principal surfaceY; a groove forming process of forming a groovein the dividing region DA from the first principal surfaceX side; and a grinding process of grinding the substratefrom the second principal surfaceY side, to divide the substrateinto a plurality of element chips. The grooveincludes a first regionconstituted by a side surface having a first surface roughness, and a second regionconstituted by a side surface having a second surface roughness larger than the first surface roughness. In the grinding process, grinding of the substrateis performed until reaching the first regionof the groove

Element chip manufacturing method

Disclosed is a method for producing element chips. The method includes: a preparing step of preparing a substratethat is held on a holding sheetthat is supported by a frame, the substrate including element regions and dicing regions; a protective film forming step of forming a protective filmso as to cover the frame, the holding sheet, and the substrate; a patterning step of removing a part of the protective filmso as to expose the dicing regions of the substrate; a plasma dicing step including a process that uses a plasma that contains fluorine, the plasma dicing step being a step of individualizing the substrateinto a plurality of element chips; and a fluorine removing step of removing, together with the protective film, fluorine attached to the protective filmin the plasma dicing step.

Method for producing element chips

Disclosed is a plasma processing apparatusincluding a chamber, a stage, a dielectric member, a cover, a gas introduction path, and an induction coil. The induction coilincludes a first induction coilinstalled so as to overlap a central region Rof the dielectric member, and a second induction coilinstalled so as to overlap a peripheral region Routside the central region Rof the dielectric member. The coverhas a first gas holeformed at a position overlapping the central region Rand a second gas holeformed at a position overlapping the peripheral region R. The gas introduction pathhas a first gas introduction pathcommunicating with the first gas holeand a second gas introduction pathcommunicating with the second gas hole

Plasma processing apparatus and method for using plasma processing apparatus

An element chip smoothing method including: an element chip preparation step of preparing at least one element chip including a first surface covered with a resin film, a second surface opposite the first surface, and a sidewall connecting the first surface to the second surface and having ruggedness; a sidewall cleaning step of exposing the element chip to a first plasma, to remove deposits adhering to the sidewall, with the resin film allowed to continue to exist; a sidewall oxidation step of exposing the element chip to a second plasma, after the sidewall cleaning step, to oxidize a surface of the sidewall, with the resin film allowed to continue to exist; and a sidewall etching step of exposing the element chip to a third plasma, after the sidewall oxidation step, to etch the sidewall, with the resin film allowed to continue to exist.

Element chip smoothing method and element chip manufacturing method

An element chip cleaning method including: an element chip preparation step of preparing at least one element chip having a first surface and a second surface opposite the first surface, the first surface covered with a resin film; a first cleaning step of bringing a first cleaning liquid into contact with the resin film, the first cleaning liquid including a solvent that dissolves at least part of a resin component contained in the resin film; and a second cleaning step of spraying a second cleaning liquid against the resin film from the first surface side of the element chip, after the first cleaning step.

Growing community of inventors

Osaka, Japan

Toshiyuki Takasaki