Matsushita Electric Works, Ltd.

Panasonic Electric Works Co., Ltd.

Yamaju Ceramics Co., Ltd.

Toshiyuki Suzuki

Masaru Sugimoto

Eiji Shiohama

Hideyoshi Kimura

Takuma Hashimoto

Kazuya Nakagawa

Kazuo Kamada

Mitsuru Kobayashi

Jiro Hashizume

Masahiro Ito

Takashi Tanaka

Yoshiyuki Uchinono

Yoshimitsu Nakamura

Ritsu Yamamoto

Hiroshi Yamanaka

Sadayuki Sumi

Motoo Ikari

Riichi Uotome

Hiroyuki Yagyu

Yutaka Iwahori

Ryoji Yokotani

Takaaki Chuzawa

Tomoaki Matsushima

Ryuji Otani

Ryo Taniguchi

Nobuyuki Asahi

Shohei Yamamoto

Takehiko Toguchi

Satoshi Mori

Koji Nishioka

Takeshi Okamoto

Kiyoshi Goto

Atsuhiro Nakamoto

Masahide Muto

Yutaka Abe

Yoshihiro Matsumura

Ryuji Ohtani

Kunji Nakashima

Kyosuke Iribe

Yosiyuki Uchinono

Shinya Ishizaki

Kazunobu Nakata

Kunzi Nakashima

Yoshitaka Tezuka

Kazuhiro Horiuchi

Hideki Ohashi

Taishi Akiniwa

Shoichi Koyama

A light-emitting device () has a submount () and a plate for heat transfer () having a metallic plate (). The submount () has a mount base (), at least one light-emitting diode chip () mounted thereon and electrically conducting lines (-) formed on the mount base () to be connected electrically to the light-emitting diode chip (). A first plane () of the mount base () of the submount () is bonded thermally to the first plate (). For example, the plate is a circuit board having a metallic plate (), and the submount () is bonded thermally to the metallic plate () of the one of the at least one plate (). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base () for providing a plurality of heat transfer paths.

Light-emitting device

In an electronic component in which a semiconductor device such as a light emitting diode is encapsulated by an encapsulation resin and a manufacturing method of the same, formation of flash on occasion of filling a resin is prevented. The semiconductor device (SIC) is mounted in a reception concavity of a base member, and the encapsulation resin is filled into the reception concavity. After mounting the semiconductor device in the reception concavity and before filling the encapsulation resin into the reception concavity, a stopper resin layer is formed on a top face of the base member along a circumference of an aperture of the reception concavity by applying a resin. Since the circumference of the aperture of the reception concavity including electric conductive patterns and the base member is covered by the stopper resin layer, even when the encapsulation resin having low viscosity is filled into the reception concavity, leakage or proceeding due to capillarity of the encapsulation resin is prevented by the stopper resin layer. As a result, no flash of leaked encapsulation resin is formed.

Electronic component and manufacturing method of the electronic component

A light source apparatus having a radiator plate having thermally conductive properties and an insulating member coupled to at least one side of the radiator plate having a through hole provided in a side thereof facing the radiator plate. The light source apparatus further including a LED chip installed and thermally coupled to an exposed portion of the radiator plate facing the through hole, an extension inwardly projecting at the through hole from the radiator plate end of the insulating member, and a wiring pattern provided on the insulating member electrically isolated by the insulating member from the radiator plate. The light source apparatus also including bonding wires electrically connecting portions of the wiring pattern on the extension and the electrodes of the LED chip, and a light-transmissive sealing material filling the through hole for entirely encapsulating the LED chip and the bonding wires.

Light source device using LED, and method of producing same

A method of efficiently manufacturing a printed wiring board is provided. In this method, a metal thin film is formed on a substrate having a projection. Then, an initial circuit pattern is formed on the substrate by patterning the metal thin film. The initial circuit pattern comprises first and second circuit patterns isolated from each other and a conductive layer formed on the projection to make a temporary electrical connection between the first and second circuit patterns. Electroplating is performed by the passage of electric current through the initial circuit pattern to form an additional metal film on the initial circuit pattern. After the electroplating, the conductive layer on the projection is removed to provide electrical insulation between the first and second circuit patterns.

Method of manufacturing printed wiring board

A high frequency relay comprises a contact base block having pairs of fixed contacts, contact members with movable contacts, and an electromagnet for moving the contact members to open and close the fixed contacts by the movable contacts. The contact base block comprises an injection-molded base having projections on its front surface, first metal films formed as the fixed contacts on top surfaces of the projections, second metal films formed as connection terminals for outside devices on a rear surface of the base, each of which corresponds to one of the first metal films, through holes each having a conductive material on its inner surface to make an electrical connection between one of the first metal films and the corresponding second metal film in the shortest distance, and a third metal film formed on the base to provide electrical isolation from the first and second metal films, which works as electromagnetic shield as well as a ground.

High frequency relay

An LED luminaire is formed such that a plurality of LED chips are disposed three-dimensionally on an MID (molded interconnection device) substrate in a rectangular plate shape, by mounting three LED chips on bottom face of respective dents provided lengthwise and crosswise in one surface of the MID substrate, the LED chips including at least two types mutually diffferent in luminous color, desirably three types of red, blue and green colors. Any optional light distribution characteristic is made thereby easily obtainable depending on a configuration of the substrate, luminaire module can be thinned, and such delicate color difference as white color and day-light color of luminescent lamps is enabled by mixing the luminous colors of the respective LED chips.

LED luminaire with light control means

A pyroelectric-type IR receiving element comprises a pyroelectric substrate which is fixed to a supporting body at its support ends and at least one rectangular patch formed in the substrate. The patch is formed on its opposite surfaces with first and second electrodes which are overlapped to each other. The substrate has a U-shaped slit composed of a pair of side slits and a base slit connecting the side slits. The U-shaped slit surrounds continuously three sides of the patch, so that the patch is supported by the substrate in a cantilever fashion at a cantilever end which is opposed to one of the support ends of the substrate. Since a thermal stress applied to the substrate when the substrate is exposed to a temperature change is absorbed by the U-shaped slit, a stress concentration to be considered is not developed in the patch. As a result, it is possible to reduce the occurrence of popcorn noise, while maintaining good IR sensitivity.

Pyroelectric-type IR receiving element and IR sensor using the same

A sealed switch has a vessel defining therein a hermetically sealed space which receives a pair of fixed contacts and a movable contact bridging the fixed contact. The movable contact is movable between an ON-position of closing with the fixed contact and an OFF-position of separating from the fixed contacts. Hydrogen gas or hydrogen rich gas is filled in the sealed space in order to suppress arc development between the movable and fixed contacts. The plunger carries at its axial one end the movable contact and carrying at the other axial end an actuator which moves the plunger axially for movement of the movable contact from the OFF-position to the ON-position. An over-travel spring is provided to give a bias for moving the movable contact relative to the plunger in order to develop a contacting pressure between the movable and fixed contacts. The over-travel spring is supported to a spring holder secured to the plunger. The plunger is formed with a threaded portion which extends through the actuator to allow the plunger to move axially relative to the actuator for adjustment of a contact gap between the movable and fixed contact, and the spring holder is formed with stopper protrusions which project in abuttable and slidable relation to the interior surface of the vessel such that the movable contact is prevented from rotating together with the plunger. Accordingly, the spring holder is best utilized to restrict the movable contact from rotating together with the actuator to enable an easy adjustment of the contact gap simply by rotating the actuator.

Sealed contact device with contact gap adjustment capability

A method for manufacturing a printed circuit board is to form on a top surface of an insulating substrate a layer of such plating ground as a metal film, to irradiate such electromagetic wave as a laser to a boundary edge zone of non-circuit parts with respect to circuit-printing parts on the insulating substrate in correspondence to a pattern of the non-circuit parts to remove the plating ground layer at the part irradiate by the electromagnetic wave with the plating ground layer at the non-irradiated part left as formed, and thereafter to form a plating on the surface of the plating ground layer at the non-irradiated parts, whereby it is enabled to allow the laser irradiation to be carried out only with respect to the boundary edge zone of the non-circuit parts, without irradiating all over the non-circuit parts.

Method for manufacturing printed circuit board

In a method of manufacturing a printed circuit board, a photoresist layer is formed on a three-dimensionally molded substrate through a conductive layer. A planar photomask which is provided with a mask pattern and a light-transmissive pattern is placed in front of the photoresist layer. A parallel light beam is radiated to the photomask in order to give to the photoresist layer an exposed pattern of an intended width 'L' in correspondence to the light-transmissive pattern. In the present invention, the light-transmissive pattern is configured so as to satisfy the following relations:

Method of manufacturing a printed circuit board

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Nara, Japan

Toshiyuki Suzuki