Other

Resonac Corporation

Toshiyuki Sugimoto

Hiroyuki Izawa

Shohei Yamazaki

A method for classifying solder particles includes: a first step of forming an electric field between a first electrodeand a second electrodeincluded in an electrostatic attraction device, the first electrodehaving a disposition part having electrostatic diffusivity or electrical conductivity, the second electrodehaving an attraction parthaving electrical insulation properties, which faces the disposition part and is provided with a plurality of opening partsopened to the disposition part side, so as to cause solder particles P disposed on the disposition part to be electrostatically attracted to the attraction part; a second step of removing solder particles Pattracted to areas other than the opening partsof the attraction part; and a third step of collecting solder particles Paccommodated in the opening parts, from the attraction partthat has been subjected to the second step.

Solder particle classifying method, solder particle, solder particle classifying system, adhesive composition, and adhesive film

A method for dispersing conductive particles includes: forming an electric field between a first electrode and a second electrode of an electrostatic adsorption device including the first electrode including a disposition part having electrostatic diffusivity or conductivity on which particles are disposed and the second electrode including an adsorption part having electrostatic diffusivity or conductivity and facing the disposition part, to cause a blend particle in which the conductive particles each having a particle size smaller than a particle size of an intermediate particle are attached to the intermediate particle and which is disposed on the disposition part, to reciprocate between the disposition part and the adsorption part, and to cause the conductive particles to be adsorbed onto the adsorption part.

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Yamagata, Japan

Toshiyuki Sugimoto