Tdk Corporation

Toshiyuki Nagatsuka

Tsutomu Yasui

Eiju Komuro

Ryoichi Kondo

Takaaki Domon

Hiroyuki Ohira

Yumiko Iijima

A circuit device includes at least one under bump metal formed on a surface of a substrate and a connection bump provided on the uppermost layer of the under bump metal. At least one laminated metallic film is formed on part of or all of wiring pattern formed on the surface of the substrate, so that the laminated metallic film formed consists of the same material and has the same thickness as the under bump metal.

Circuit device and method of manufacturing the circuit device

In an electronic component having a piezo-electric resonatorformed on an element substrateand obtaining a signal having a predetermined resonant frequency by a bulk wave propagating within a piezo-electric film, a mounting substrateon which the piezo-electric resonatoris mounted by face-down bonding through N bumps, when a maximum diameter of said N bumpsis defined as D &#x3bc;m, die shear strength of said N bumpsis not smaller than ND/6 (g), preferably, not smaller than ND/3.6 (g).

Electronic component including piezo-electric resonator mounted by face-down bonding with a required die shear strength

A method for soldering an electronic component capable of accomplishing satisfactory soldering of an electronic component using paste solder even in an oven constructed into a non-closed structure which causes flowing of an ambient atmosphere. Dehumidified air is introduced through a dehumidified air inlet section into the oven to keep a dehumidified atmosphere in the oven, to thereby prevented activity of flux contained in the paste flux from being deteriorated.

Growing community of inventors

Tokyo, Japan

Toshiyuki Nagatsuka