Fujitsu Corporation

Other

Shinko Electric Industries Co., Ltd.

Toshiyuki Motooka

Hideharu Sakoda

Tatsuharu Matsuda

Junichi Kasai

Masataka Mizukoshi

Yoshiyuki Yoneda

Toshimi Kawahara

Ryuji Nomoto

Muneharu Morioka

Mamoru Suwa

Kazuto Tsuji

Masaharu Minamizawa

Mitsuyoshi Imai

Kenji Itasaka

Terumi Kamifukumoto

Kunio Kodama

Masaki Sakaguchi

Hideki Toya

Naoki Yamabe

Masashi Takenaka

Shigeki Harada

Joji Fujimori

Masahiro Yonemochi

Syuichirou Takahashi

Jouji Fujimori

Tatsuro Yamashita

Syuichirou Takahasi

In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess formed at a position of the metal substrate corresponding to the resin protuberance and having a rugged bottom surface and/or a rugged side surface, and a plated film formed on the inner surface of the recess.

Resin for semiconductor wire

A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts. Outer circumference surfaces of the resin package are upright surfaces defined by cutting.

Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame

A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts.

In order to improve adhesion between a plated film which functions as an external connection terminal of a semiconductor device and a surface of a resin protuberance and to improve reliability, a carrier substrate includes a metal substrate which is shaped into a sheet form, to which a semiconductor chip is fixed, and which is removed before the semiconductor device is completed, a recess formed at a position of the metal substrate corresponding to the resin protuberance and having a rugged bottom surface and/or a rugged side surface, and a plated film formed on the inner surface of the recess

Carrier substrate for producing semiconductor device

A semiconductor device which comprises a semiconductor chip packaged in a resin package and having an electrode terminal wire-bonded to a conductor cap having one end defining an exposed top of an external connection terminal protruding from the resin package and the other end defining an orifice embedded in the resin package, wherein the orifice of the conductor cap has a radially outward extending flange which anchors the conductor cap to the resin package. The process of producing the semiconductor device is also disclosed.

Semiconductor device and process of producing same

A method of fabricating a semiconductor device includes a step of attaching a circuit substrate on a semiconductor wafer in alignment with each other, providing an electrical interconnection between the circuit substrate and semiconductor devices formed in the wafer, providing solder bumps on the circuit substrate, and dicing the semiconductor wafer together with the circuit substrate thereon along a scribe line.

Semiconductor device having a ball grid array and a fabrication process thereof

A method of forming a semiconductor device having a semiconductor chip having electrodes on which electrode pins are formed includes the steps of forming a complex having the electrode pins fixed in a fixing member, an arrangement of the electrode pins corresponding to that of the electrodes, connecting the electrode pins with the electrodes by mounting the complex on the semiconductor chip, and removing the fixing member from the complex mounted on the semiconductor chip.

Semiconductor device with reliable electrodes of projecting shape and

A test board used for testing a semiconductor device provided with projection electrodes includes a main board and testing electrodes. The testing electrodes are provided on the main board, each projecting upwardly from the main board. When the semiconductor device is tested, the testing electrodes are electrically connected to the projection electrodes by insertion of the testing electrodes into the projection electrodes. The semiconductor device is mounted on the main board to test the semiconductor device through the testing electrodes.

Test board for testing a semiconductor device and method of testing the

Test board for testing a semiconductor device, method of testing the

Growing community of inventors

Kawasaki, Japan

Toshiyuki Motooka