Kabushiki Kaisha Nihon Micronics

Kabushiki Kaisha Toshiba

Micronics Japan Co., Ltd.

Toshiyuki Kudo

Tatsuo Inoue

Yoshinori Kikuchi

Katsushi Mikuni

Hidehiro Kiyofuji

Toshinori Omori

Takayasu Sugai

Yoshihito Onuma

Takao Yasuta

Tetsuya Iwabuchi

Takayuki Narumi

Seiji Kanazawa

Masatoshi Yokouchi

Issei Sakurada

To maintain the horizontalness of a probe card even, if the number of measured DUTs is increased. An electrical connecting apparatus according to the present, disclosure comprises a support member having a lower surface region in which a level part is formed and a wiring board provided adjacent to the lower surface of the support member, and to be connected to a testing device side. The electrical connecting apparatus comprises: a connection unit having multiple connection terminals; a probe substrate electrically connecting multiple probes to the connection terminals; multiple anchors arranged on the upper surface of the probe substrate; and multiple supports functioning as supports between corresponding ones of the anchors and the support member via the wiring board and the connection unit. The anchors and the supports are arranged at positions including: each vertex point of a square; each vertex point of two rectangles having respective two long sides passing through corresponding facing vertex points on one side and corresponding facing vertex points on the other side of the square; and multiple points along a virtual circle centered on the center of the square and having a diameter surrounding each of the rectangles.

Electrical connecting apparatus

A multi-layer wiring board includes wiring layers stacked on a substrate with an insulating layer between each layer. A wire formed in the wiring layer consists of a first layer and a second layer to form a double layered structure. The first layer is made of a first conductive material and the second layer is made of a second conductive material having relative magnetic permeability of 10 or more and larger than that of the first conductive material. The characteristic impedance of the wire is adjusted to a value closer to 50 ohms than that of a wire which has the same thickness as of the wire with the double layered structure, and is made only of the first conductive material.

Multilayer wiring board with enclosed Ur-variant dual conductive layer

Provided is a probe card capable of effectively placing electronic parts. A probe card according to the present invention includes a plurality of probes that come into contact with a plurality of electrodes of a device, a probe board including the plurality of probes provided thereon, a wiring board that is placed facing a surface of the probe board opposite to a surface including the probes provided thereon, a connector that includes a connection pin and a holder, in which the connection pin electrically connects a line of the probe board and a line of the wiring board, and the holder holds the connection pin between the probe board and the wiring board, and a first electronic part that is mounted on a probe board side surface of the wiring board and placed in a mounting space formed by a through hole or a recess provided in the holder.

Probe card and testing apparatus

An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step.

Method and apparatus for testing integrated circuit

A computer program generates a wire routing pattern that connects one driver with a plurality of receivers. The overlapping length of each vector pair, which consists of any two vectors headed from the driver to the receivers, is calculated. One vector pair that has the greatest overlapping length is selected. For the selected vector pair, three kinds of common nodes are created, each of which is used to make a common path part of the way to the receivers, to generate three kinds of renewed vector patterns. The operations are repeated and plural candidate routing patters are acquired. One candidate routing pattern having the smallest total wiring length is selected as the optimum routing pattern. If there exist plural patterns that have the same smallest total wiring length, one pattern can be selected that has the smallest one of the greatest. D-R path lengths.

Computer program and method for generating wire routing pattern

An electronic safekeeping method, including displaying a contractual coverage of a contract at a covenantee terminal connected to a contractor server storing information of the contractual coverage; inputting contract agreement information representing whether agreeing to the contractual coverage or not, at the covenantee terminal; inputting safekeeping agreement information representing whether agreeing to a safekeeping of the contractual coverage or not, at the covenantee terminal, when the contract agreement information agreeing to the contractual coverage is inputted; requesting a contract safekeeping server to store the contractual coverage, when the safekeeping agreement information agreeing to the safekeeping is inputted; issuing a contract ID for identifying the contract at the contract safekeeping server in accordance with the request; and transferring the issued contract ID from the contract safekeeping server to the covenantee terminal and the contractor server.

Electronic contract safekeeping method, electronic contract verifying method, contractor server, contract safekeeping server, electronic contract safekeeping system, and memory medium

Growing community of inventors

Tokyo, Japan

Toshiyuki Kudo