Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Toshiyuki Koyama

Hideaki Watanabe

Kiyoshi Imai

Shigeki Imafuku

Dai Yokoyama

Akihiko Wachi

Nobuyasu Nagafuku

Masaya Matsumoto

Hiromi Kinoshita

Taira Ishii

Satoshi Taniguchi

Provided is a method for mounting an electronic component having a plurality of board insert type leads on a board. The method includes a holding process which chucks one of the plurality of leads of the electronic component to hold the electronic component, and an inserting process which inserts the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.

Method for mounting electronic component

Provided is an apparatus for mounting an electronic component having a plurality of board insert type leads on a board. The apparatus includes a mounting head having a first chuck unit which chucks one of the plurality of leads of the electronic component, a second chuck unit which chucks another one of the plurality of leads and a position adjusting unit which changes relative positions of the first chuck unit and the second chuck unit to hold the electronic component, and a mounting head moving unit which moves the mounting head to insert the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.

Apparatus for mounting electronic component

This invention relates to an electronic component mounting apparatus. In the apparatus, a rotary body for changing the direction of a component mounting section is fixed to a hollow rotary shaft with a flange. The hollow rotary shaft is provided in a hollow motor and rotated integrally with the rotary body by driving of the hollow motor. A wire extending from an electric component, which is provided in the rotary body for changing the direction of the component mounting section, is arranged in the hollow rotary shaft of the hollow motor. An end of the wire is fixed to the rotary body, and the wire is arranged with looseness or into a spiral in the hollow rotary shaft. Further a lateral surface of inside the hollow rotary shaft and a surface of a coupling shaft are coated with protective materials.

Electronic component mounting apparatus

An apparatus for mounting a wire component on a substrate has a feed device for feeding a wire a predetermined length intermittently, and an insert device for cutting the wire fed out by the feed device, bending the cut wire to form a wire component, rotating and positioning the wire component, and then inserting the wire component in a hole defined in the substrate. In particular, irrespective of a position of the insert device, the feed device feeds out the wire in a direction where no interference would occur between the feed device and the insert device.

Apparatus for mounting a wire component

A piezoelectric element is mounted to a clinch lever for detecting stress-strain generated therein when cutting and clinching leads of an electronic component that has been inserted in corresponding holes formed in a circuit board substrate. A detected voltage d is compared to a threshold voltage s selected from a plurality of threshold voltages preset in the device. When the detected voltage d exceeds the threshold voltage s, the insertion detecting section outputs a signal indicating that the insertion of the leads in the holes has been performed normally.

Component mounting apparatus and device for detecting attachment on component substrate

The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.

Growing community of inventors

Yamanashi, Japan

Toshiyuki Koyama