Adv Antest Corporation

Toshiyuki Kiyokawa

Kazuya Ohtani

Tsuyoshi Yamashita

Hiroyuki Takahashi

Noriyuki Igarashi

Hisao Hayama

Takashi Naito

Hiroshi Okuda

Kenichi Shimada

Yoshihito Kobayashi

Akio Kojima

Yuya Yamada

Hiroto Nakamura

Yoshiharu Umemura

Yoshiyuki Masuo

Keiichi Fukumoto

Haruki Nakajima

Takao Murayama

Daisuke Takano

Yukio Kanno

Koya Karino

Toshikazu Okawa

A test carrier carried in a state of accommodating a device under test (DUT) includes: a carrier body that holds the DUT; and a lid member that covers the DUT and is attached to the carrier body. The lid member includes: a plate-like main body; and a pusher protruding from the main body in a convex shape.

Test carrier and carrier assembling apparatus

A test carrier carried in a state of accommodating a device under test (DUT) includes: a carrier body that holds the DUT, and a lid member that covers the DUT and is attached to the carrier body. The carrier body has a first through-hole for positioning that is provided to face the DUT.

A test carrier carried in a state of accommodating a device under test (DUT) includes: a carrier body that holds the DUT; and a lid member that covers the DUT and is attached to the carrier body. The lid member includes a through-hole for sucking the DUT that is provided to face the DUT and penetrating through the lid member.

A test carrier carried in a state of accommodating a device under test (DUT) includes: a carrier body that holds the DUT; a lid member that covers the DUT and is attached to the carrier body; and an identifier for identifying an individual of the test carrier.

A test carrier that accommodates a device under test (DUT) and has a through-hole facing the DUT, including: a movable valve that: opens by suction through the through hole such that the DUT is sucked through the through hole.

Test carrier

A test carrier that accommodates a DUT and includes a first flow passage through which fluid supplied from an outside of the test carrier flows.

Test carrier and electronic component testing apparatus

A test carrier carried in a state of accommodating a device under test (DUT) includes: a carrier body that holds the DUT; and a lid member that covers the DUT and is attached to the carrier body. The carrier body has contactors provided to correspond to terminals of the DUT, external terminals electrically connected to the contactors, and a first through-hole for positioning that is provided to face the DUT. The first through-hole penetrates the carrier body so that a part of the DUT is seen from an outside through the first through-hole.

Provided is an electronic device handling apparatus capable of increasing the number of simultaneous measurements while suppressing the increase in cost. An electronic device handling apparatus, which moves bare dies relative to a probe card, includes: a thermal head which includes a plurality of holding regions each of which holds the bare die and has openings; at least one lift unit which is movably held by the thermal head so as to correspond to the holding regions and is able to advance and retreat through the openings; a moving device which moves the thermal head; and a fixed arm which is able to support the one lift unit.

Electronic device handling apparatus and electronic device testing apparatus

An apparatus includes a plurality of test heads to which probe cards are electrically connected; a wafer tray which is able to hold a semiconductor wafer; and an alignment apparatus which positions the semiconductor wafer held on the wafer tray relatively with respect to the probe card so as to make the wafer tray face the probe card. The wafer tray has a pressure reducing mechanism which pulls the wafer tray toward the probe card. The alignment apparatus is configured to be able to move along the array direction of the test heads.

Semiconductor wafer test apparatus

In order to shorten testing time of a plurality of devices under test formed on a semiconductor wafer, a wafer tray used by a test apparatus performing the test is provided. The wafer tray includes a first flow passage for fixing the semiconductor wafer to the wafer tray using vacuum suction, a second flow passage for fixing the wafer tray to the test apparatus using vacuum suction, and a heater for heating a loading surface on which at least the semiconductor wafer is loaded. By using this wafer tray, the semiconductor wafer, which is the object being tested, can be smoothly attached to and detached from different test heads, and testing can be begun quickly after the semiconductor wafer is attached to a test head.

Wafer tray and test apparatus

A test apparatus comprising a position information acquiring section that acquires position information concerning first terminals on a surface of a device under test and position information concerning second terminals on a surface of a probe card used for testing the device under test; a control section that calculates a displacement amount between each first terminal and a corresponding second terminal, based on the position information concerning the first terminals and the position information concerning the second terminals, and determines relative positions of the device under test and the probe card such that a maximum value from among the calculated displacement amounts is less than a predetermined value; and an aligning section that adjusts the relative positions of the device under test and the probe card, based on a signal from the control section, and electrically connects the device under test to the probe card.

Test apparatus, test method and computer readable medium

A test apparatus comprising a plurality of test units that test a device under test; a plurality of housing sections that respectively house the test units therein; a plurality of opening/closing sections that are disposed respectively in the housing sections and that expose the test units to the outside or isolate the test units from the outside; and a control section that independently controls whether each of the opening/closing sections is allowed to be opened. The control section may allow test units that are not supplied with power to be exposed to the outside. For at least one of (i) a period during which one of the test units is performing a predetermined operation, (ii) a predetermined period before the period during which one of the test units is performing the predetermined operation, and (iii) a predetermined period after the period during which one of the test units is performing the predetermined operation, the control section may prohibit other test units from being exposed to the outside.

Test apparatus and test method

A holding side contact arm () for holding an IC to be tested is positioned on the optical axis (OP) of an alignment CCD camera () of an alignment device (), the IC to be tested is inserted to a first opening () formed on an alignment movable portion (), and a contact member () of the holding side contact arm () is brought to contact the alignment movable portion (). Then, an alignment amount for correcting a position of the IC to be tested is calculated by taking an image by the camera () and performing image processing. A lock-and-free means () provided to a first contact arm () is made to be in a non-restricted state, a movable portion driving device () is driven based on the alignment amount, and the holding side contact arm () contacting the alignment movable portion () is moved with respect to a root side contact arm (), so that alignment of a position of the IC to be tested is performed.

Electronic part test apparatus

A contact arm for bringing ICs to be tested to contact a contact portion, includes a holding head for holding said electronic devices, a floating mechanism provided between a drive mechanism for moving close to or away from said contact portion and said holding head for supporting said holding head movable about said drive mechanism, a diaphragm cylinder provided between said drive mechanism and said holding head for adjusting a relative pressing pressure from said drive mechanism to said holding head. A plurality of diaphragm cylinders are provided to one holding head.

Contact arm and electronic device testing apparatus using the same

A contact arm for bringing ICs to be tested to contact a contact portion, comprises a holding head for holding said electronic devices, a floating mechanism provided between a drive mechanism for moving close to or away from said contact portion and said holding head for supporting said holding head movable about said drive mechanism, a diaphragm cylinder provided between said drive mechanism and said holding head for adjusting a relative pressing pressure from said drive mechanism to said holding head. A plurality of diaphragm cylinders are provided to one holding head.

Growing community of inventors

Tokyo, Japan

Toshiyuki Kiyokawa