Konica Minolta Opto, Inc.

Konica Minolta, Inc.

Konica Minolta Advanced Layers, Inc.

Toshiyuki Imai

Shigeru Hosoe

Akira Sato

Hiroyuki Matsuda

Tougo Teramoto

Yuiti Fujii

Daisuke Watanabe

Yasushi Iijima

Isao Takano

Tomoyuki Morimoto

Method for producing a lens array, which can prevent a weld from being formed in the peripheral part of a lens part and suppress increase of a work time of a transfer mold, and a molding mold. Since a master moldof a molding mold has a plurality of linear groove partssurrounding a plurality of cavity parts, resin hardly spreads to a corner partwhere the adjacent linear groove partsandintersect each other and it is possible to prevent portions of the resin which have run over toward the adjacent groove partsandfrom spreading so as to come close to each other and being brought into contact with each other to create a weld trapping air bubbles.

Method for producing lens array, and molding mold

Disclosed is an image pickup device, by which cut resistance at the time of cutting a wafer lens is reduced, high production efficiency is maintained, and excellent optical characteristics are obtained. The image pickup device has a first lens block, a second lens block, a spacer, and a sensor unit. The side surface section of the first lens block, the side surface section of the second lens block, and the side surface section of the spacer are formed on the same plane. A lens cover that covers the first and the second lens blocks is provided in a step formed by respective side surface sections of the first lens block, the second lens block and the spacer, and the side surface section of the sensor unit.

Image pickup device and method for manufacturing the image pickup device

Provided are a wafer lens production method, an intermediate die, an optical component, a molding die, and a molding die production method. The production method of a wafer lens () includes a first intermediate die production step using a die (), a second intermediate die production step using the first intermediate die (), and a wafer lens production step using the second intermediate die (). A first intermediate-die substrate () is provided with a depressed section () on the surface facing the die (). When photo-curable resin (A) is pressed, at least a portion closer to the first intermediate-die substrate () among the top () and the peripheral section () of the die () is arranged in the depressed section (), and a gap is provided so that the die () does not contact with a depressed plane () of the depressed section ().

Production method of wafer lens, intermediate die, optical component, molding die, and production method of molding die

A machining method of machining a transfer optical surface on a optical element producing die having the transfer optical surface made of a material having Vickers hardness of Hv1500 or more, comprising: machining the transfer optical surface on the optical element producing die by cutting with a cutting tool, wherein a rake face of a tip of a blade of the cutting tool is set with an angle of minus values at an incising point on a surface to be machined.

Transfer optical surface machining method, optical device producing mold and optical device

In a vibration cutting unit, a root portion of a holding member for supporting a vibration body is fixed on a fixed portion of a node portion which is common to axial vibration and bending vibration, on a jointless basis. Therefore, the node portion, namely, a vibration body main part is firmly fixed, thereby, the vibration body main part is supported stably, and vibrations of the vibration body main part is stabilized. In other words, vibrations under the mode where the vibration body main part cannot be controlled can be restrained, and works representing objects to be processed can be processed accurately.

Vibration body for cutting, vibration cutting unit, processing apparatus, molding die and optical element

In the assembly of vibration body, the first width in the lateral direction (X axis direction) is greater than the second width in the longitudinal direction (Y axis direction) in the cross sectional form perpendicular to Z axis of the first portion on the tip side from the closest node position, thereby, the rigidity of a vibration body main part in the X axis direction can be enhanced, and lateral bending vibrations on fixing portion can be restrained. Consequently, an object can be processed highly accurately by the assembly of vibration body that is controlled with a high precision.

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Hachioji, Japan

Toshiyuki Imai