Denka Company Limited

Toshiyuki Ibayashi

Toshiyuki Morishita

Hiromitsu Chatani

Shimpei Hirokawa

Isao Sugimoto

Hiroyuki Kurimura

Yukio Eda

Eitaro Fukutaka

Takayuki Matsumoto

Yutaka Ogino

An electron source capable of suppressing consumption of an electron emission material is provide. The present invention provides an electron source including: an electron emission material; and, an electron emission-suppressing material covering a side surface of the electron emission material, wherein a work function of the electron emission-suppressing material is higher than that of the electron emission material, and a thermal emissivity of the electron emission-suppressing material is lower than that of the electron emission material.

Electron source and production method therefor

Provided is a jig having a structure that differs from conventional jigs and enables flat plates to be bonded while suppressing an air bubble formation. A flat-plate bonding jig is provided with the following: a first surface; a second surface that is on the opposite side of the first surface, has a plurality of suction holes for sucking a flat-plate, and is curved outward in a substantially arc shape; a main body connecting the first surface and the second surface; and a communication means that is disposed in the main body and allows the suction holes to communicate with a suction means.

Flat-plate bonding jig and method of manufacturing flat-plate laminated body

There is provided an ultrasonic cleaning method capable of reliably cleaning to remove adhesive components even when the adhesive components adhere to a rigid substrate. The ultrasonic cleaning method comprises performing the following steps (1) to (5), in this order: (1) a step of immersing a rigid substrate having an adhesive adhering to a surface thereof in an aromatic alcohol-based cleaning liquid at 25 to 60&#xb0; C.; (2) a step of cleaning off the adhesive on the rigid substrate by ultrasonic oscillation while keeping the state where the rigid substrate is immersed in the step (1); (3) a step of subsequently immersing the rigid substrate in a glycol ether-based cleaning liquid at 25 to 60&#xb0; C.; (4) a step of rinsing off the aromatic alcohol-based cleaning liquid adhering to the rigid substrate by ultrasonic oscillation while keeping the state where the rigid substrate is immersed in the step (3); and (5) a step of subsequently rinsing off the glycol ether-based cleaning liquid and aromatic alcohol-based cleaning liquid adhering to the rigid substrate with water.

Ultrasonic cleaning method and apparatus

Growing community of inventors

Shibukawa, Japan

Toshiyuki Ibayashi