Ricoh Company, Ltd.

Toshiyuki Enomoto

Yasuhiro Tani

Yutaka Shimazaki

Hiroyuki Endo

Hiroyuki Endoh

Jun Zhang

Yoshiyuki Sato

Shigeru Inoue

An abrasive grain including a porous particle material in which a large number of secondary particles contain gaps between primary particles bonded to each other. The secondary particles are produced by growing primary particles into secondary particles, which are formed by cohesion of a large number of primary particles, via a heat treatment at a temperature sufficient to form necks at bonding points between the primary particles.

Abrasive grain and method for producing it, polishing tool and method for producing it, grinding wheel and method for producing it, and polishing apparatus

An abrasive grain including a porous particle material in which a large number of fine particles for cutting edges form gaps partly among them and bond loosely each other. The particles for the cutting edges are produced by growing primary particles in secondary particles, which are formed by cohesion of a large number of primary particles, with a heat treatment at a temperature of forming necks at bonding points among the primary particles.

A processing tool is used to carry out a fixed-abrasive grinding process on a surface of a silicon work-piece. The processing tool includes abrasive grains made up silica grains. A primary average grain size of the silica grains is desirably 0.8 nm to 10 &mgr;m.

Processing tool, method of producing tool, processing method and processing apparatus

An abrasive wire provides an efficient cutting operation with high accuracy and a longer service life. Abrasive grains are provided around a core wire. The abrasive grains are bonded to the core wire by a light curing resin or an electron beam curing resin which can be cured within a few seconds. Accordingly, the curing operation can be performed while the core wire is moved in the direction of the longitudinal axis of the core wire. Thus, a long abrasive wire can be fabricated at reduced time and cost.

Abrasive wire for a wire saw and a method of manufacturing the abrasive wire

An electrolytic in-process dressing method, an electrolytic in-process dressing grinding apparatus, and an electrolytic in-process dressing grindstone, for grinding workpiece as the grindstone is being subjected to electrolytic in-process dressing, are provided, in which the grindstone is made of abrasive grains and a binding material which is capable of forming a uniform and fine passive layer at the grinding surface thereof and also capable of preventing excessive elusion of the binding material, thereby preventing the formation of chips at the ground surface in the course of grinding operation.

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Tokyo, Japan

Toshiyuki Enomoto