Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Matsushita Industrial Co., Ltd.

Toshiyuki Asahi

Yasuhiro Sugaya

Seiichi Nakatani

Shingo Komatsu

Yoshiyuki Yamamoto

Koichi Hirano

Tousaku Nishiyama

Kojiro Okuyama

Seiji Karashima

Yasuyuki Matsuoka

Takeshi Nakayama

Hiroshi Nakatsuka

Yoshihisa Yamashita

Osamu Kawasaki

Takashi Ichiryu

Katsunori Moritoki

Yukihiro Ishimaru

Junichi Kotani

Yoshiyuki Saito

Yutaka Taguchi

Naoyuki Tani

Yoshito Kitagawa

Osamu Shibata

Takashi Matsuda

Satoru Yuhaku

Hideki Iwaki

Katsumasa Miki

Kiyotaka Komori

Mitsuyoshi Nishino

Satoru Yuuhaku

Yoshinobu Idogawa

Akiyoshi Nozue

Kazuo Ohtani

Takayuki Suzue

Hiroaki Suzuki

Osamu Inoue

Junichi Kato

Tetsuyoshi Ogura

Yukihiro Shimasaki

Nobuya Matsutani

Masamitsu Nishida

Hiroyuki Hase

Masaaki Katsumata

Tatsuo Sasaoka

Eiji Kawamoto

Toshio Fujii

Hidenori Uematsu

Tsuyoshi Himori

Koji Shimoyama

Hiroyuki Ishitomi

Tetsuyosi Ogura

Kazuhiko Honjo

Hiroshi Tomita

Osamu Moriya

Chie Sasaki

Hisayoshi Kato

Yoshiyuki Saitou

Shigeyuki Inagaki

Hironori Nagasaki

A leakage transformer includes a core and a printed wiring board. The core includes a first magnetic leg and a second magnetic leg. The second magnetic leg is spaced from the first magnetic leg. The printed wiring board includes an insulating portion and conductor wiring. The conductor wiring includes a first coil and a second coil. The first coil is formed of a first winding and is wound around only the first magnetic leg, not around the second magnetic leg. The second coil is formed of a second winding and includes a first part and a second part. The first part is wound around only the first magnetic leg, not around the second magnetic leg. The second part is wound around both the first and second magnetic legs.

Leakage transformer

A reactor includes a core and first and second coils wound around the core about first and second center axes extended in a first direction, respectively. The core includes first and second core legs disposed inside the first and second coils, respectively. The first and second coils are arranged in a second direction perpendicular to the first direction. The first coil includes a first wound-wire part wound around the first core leg and two first terminal parts extended from both end portions of the first wound-wire part, respectively. The second coil includes a second wound-wire part wound around the second core leg and two second terminal parts extended from both end portions of the second wiring wire part, respectively. The second coil has the same shape and the same dimension as the first coil.

Reactor

A reactor includes a first and second winding, a coupling core portion, and a first and second core portion. The coupling core portion forms a coupling magnetic path, through which a magnetic flux generated by the first winding when the first winding is energized and a magnetic flux generated by the second winding when the second winding is energized pass, which magnetically couples the first winding and the second winding together. The first core portion forms a first magnetic path, through which the magnetic flux generated by the first winding when the first winding is energized passes and is aligned with a first plane. The second core portion forms a second magnetic path, through which the magnetic flux generated by the second winding when the second winding is energized passes and is aligned with a second plane. The coupling plane intersects at right angles with the first and second plane.

Reactor, core member, and power supply circuit

A reactor includes a coil body, an exterior case, and a filler. The coil body includes a core and a coil wound around the core. The exterior case includes a metal structure and a resin frame. The metal structure has a bottom surface and a side wall provided to stand upright from the bottom surface. The bottom surface and the side wall of the metal structure are unitarily formed with each other. The frame is disposed at an opposite side to the bottom surface of the metal structure. The exterior case houses the core and the coil. The filler is filled between the exterior case and the coil body.

A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D) of 2 to 15 &#x3bc;m and (B) magnesium oxide having an average particle diameter (D) of 0.5 to 15 &#x3bc;m, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

Prepreg, laminate, metal foil-clad laminate, circuit board and LED module

A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor. By providing pores in substantially the same plane as wiring patterns in the printed-wiring-board including insulating layers, wiring pattern layers made of copper foil alternately laminated on the insulating layers, and pores provided between the wiring patterns, a printed-wiring-board having high connection reliability free from delamination or cracks during heating or in heat cycle conditions.

Printed wiring board, build-up multi-layer board, and production method therefor

Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D) of 2 to 15 &#x3bc;m, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D) of 2 to 15 &#x3bc;m and inorganic particles that have an average particle diameter (D) of 2 to 15 &#x3bc;m and that contain crystal water having a release initiation temperature of 400&#xb0; C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D) of 1.5 &#x3bc;m or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.

Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting

A thermally conductive composition is made to contain a cured thermosetting resin containing a crystalline epoxy resin component, and an inorganic filler. The content by percentage of the inorganic filler in the thermally conductive composition is 66% or more and 90% or less by volume. This thermally conductive composition has a main portion made mainly of the inorganic filler, and a surface layer portion made mainly of the crystalline epoxy component and formed on the main portion to be continuous to the main portion.

Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition

A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in componentincludes an insulating sheet substratewhich has an upper surface, a lower surfaceopposed to the upper surfaceand a side surfacewhich connects these surfaces. At least one wiringextends from the upper surface to the lower surface through the side surface, and an electronic componentis disposed within the sheet substrate.

Module with a built-in component, and electronic device with the same

A passive component incorporating interposer includes a double-sided circuit board () having a wiring layer () on both sides, a passive component () mounted on the wiring layer () on one surface of the double-sided circuit board (), a second insulating layer () made of woven fabric or non-woven fabric or inorganic filler and thermosetting resin laminated on the surface of the double-sided circuit board () mounted with the passive component (), a first insulating layer () made of woven fabric or non-woven fabric or inorganic filler and thermosetting resin laminated on the other surface of the double-sided circuit board () not mounted with the passive component (), first and second wiring layers () formed on the first and second insulating layers (), and a through hole () for electrically connecting the wiring layers () disposed on both surfaces of the double-sided circuit board () and the first and second wiring layers (), where the first wiring layer () is formed to enable mounting of a semiconductor element ().

Passive component incorporating interposer

A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

Transfer material used for producing a wiring substrate

A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.

Multilayer wiring board

A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.

Method for producing connection member

The mounting board has a capacitor-forming sheet made from a valve metal, first and second board-forming structures, first and second electrodes, an extractor electrode, and a conductive polymer. The capacitor-forming sheet has an inner layer and a rough oxide film on at least one face of the inner layer. The first board-forming structure is provided on a face of the capacitor-forming sheet, and the second board-forming structure is provided on another face thereof on a side opposite to the first one. The first and second electrodes are isolated to each other and provided on a surface of at least one of the first and second board-forming structures. The extractor electrode and conductive polymer are provided inside at least one of the first and second board-forming structures. The extractor electrode electrically-connects the first electrode with the inner layer. The conductive polymer electrically-connects the second electrode with the rough oxide film.

Mounting board, mounted body, and electronic equipment using the same

The present invention provides a tamper resistant circuit board, an apparatus and method for aiding the design of the circuit board, a computer readable storage medium having stored therein a program for performing the method, and a mobile terminal containing the circuit board. The tamper resistant circuit board has a multilayer structure, including outermost substrates and an internal layer between the outermost substrates, and a signal line through which a confidential signal flows. The signal line is wired such as the confidential signal does not appear on the outer surfaces of the outermost substrates of the multilayer structure of the circuit board.

Mobile terminal, circuit board, circuit board design aiding apparatus and method, design aiding program, and storage medium having stored therein design aiding program

Growing community of inventors

Osaka, Japan

Toshiyuki Asahi