Tdk Corporation

Toshiyasu Fujiwara

Kyung-Ku Choi

Takeshi Suga

Katsuo Sato

Hitoshi Sakuma

Hajime Kuwajima

Taku Masai

Masami Sasaki

Takeshi Oohashi

Yoshihisa Suzuki

Yukio Mitake

Chengbin Lin

Yoshikazu Tsuya

Naoto Ohyama

A directional coupler including a main line having an input terminal and an output terminal, and a sub-line having a coupling terminal and an isolation terminal, the main line, the sub-line, the input terminal, the output terminal, the coupling terminal and the isolation terminal being disposed within a laminate, wherein the main line and the sub-line extend in a loop shape in parallel with and spaced apart from each other by a gap such that electromagnetic coupling is generated therebetween and such that the main line is positioned outside the sub-line on a coupling layer, the input terminal, the output terminal, the coupling terminal and the isolation terminal are disposed outside the main line, and the main line is interposed between the output terminal and the sub-line.

Directional coupler and wireless communication device

A coupler includes an input terminal and an output terminal which are provided on a substrate, a main line provided on the substrate and having one end connected to the input terminal and the other end connected to the output terminal, and a sub line including a conductive film and a resistive film which are provided on the substrate and electromagnetically coupled to the main line at a part of the conductive film. The conductive film has wiring patterns. The resistive film includes a resistive film pattern having an end portion fitted into between the wiring pattern and substrate and an end portion fitted into between the wiring pattern and substrate. The end portions and each contact the conductive film at least at its upper surface and end surface.

Coupler, electronic component, and manufacturing method for electronic component

A directional coupler according to the present invention includes a primary line for transmitting a transmission signal; an input port for inputting the transmission signal to the primary line; an output port for outputting the transmission signal from the primary line; a secondary line for electromagnetically coupling with the primary line to extract part of the transmission signal; a coupling port provided at one end of the secondary line; an isolation port provided at the other end of the secondary line; and a low pass filter unit having a function of low pass filter, disposed between the secondary line and the coupling port.

According to an embodiment of the invention, a coupler has a first line that includes a coiled main line and a second line that includes a coiled secondary line arranged to oppose the main line via an insulating layer. The coupler also has a plurality of vias that connect the separate portions of the first line arranged in the different layers and connect the separate portions of the second line arranged in the different layers, and a plurality of terminals each connected to an end of the first and second lines. The vias include an extension via connected to the main line or the secondary line that extends through the insulating layer, and the extension via wires the first line and the second line to the same side of the insulating layer.

Coupler

It is an object of the present invention to provide an electronic component module with which circuit malfunction can be adequately prevented. There are provided a base having wiring, and a thin-film magnetic device provided on one side of the base. The thin-film magnetic device comprises a first magnetic film disposed facing the base, a second magnetic film disposed on the opposite side of the first magnetic film with respect to the base, and a thin-film coil wound so as to encircle the second magnetic film a plurality of times. The thin-film coil has a plurality of first conductor pattern components provided between the first and second magnetic films, a plurality of second conductor pattern components provided on the opposite side of the second magnetic film with respect to the first magnetic film, and a plurality of connecting conductors that connect the first conductor pattern components and the second conductor pattern components in series. The relative magnetic permeability of the second magnetic film is greater than the relative magnetic permeability of the first magnetic film.

Thin-film magnetic device, and electronic component module having same

A thin film device is provided, in which inductance can be increased when a thin film coil wound on a magnetic film is provided. In a thin film coil wound on a magnetic film, thickness of lower coil portions is smaller than thickness of upper coil portions. Consequently, a magnetic property (permeability) tends to be hardly deteriorated.

Thin film device having thin film coil wound on magnetic film

The present invention provides a thin film device in which resin film does not easily separate. In a thin film device, a conductor pattern is formed on one of the main surfaces of a plate-shaped base, and the conductor pattern is covered with a resin film. This conductor pattern has a bottom face disposed on the main surface of the base, a top face that faces the bottom face and is distant from the main surface of the base, and two side faces that connect the bottom face and the top face. A depressed portion is formed in these side faces, and an insulation film extends into the depressed portion.

Thin film device

A thin film device, which can maintain desirable performance characteristics by reducing parasitic capacitance and increasing the Q factor even when a thin film coil of a solenoid type is equipped, is provided. The thin film coil of a solenoid type has a cross sectional width which varies with position along a film thickness direction.

A surface acoustic wave (SAW) device includes a plurality of SAW filters connected in cascade. An impedance matching element in the form of a SAW resonator is interposed between two adjoining SAW filters. Each filter includes a first piezoelectric substrate having a first electromechanical coupling factor and the resonator includes a second piezoelectric substrate having a second electromechanical coupling factor. The second electromechanical coupling factor is greater than the first factor so that the inductive band of the SAW resonator is wider than the pass band of the SAW filter. The device affords improved filter properties including an increased fractional bandwidth and an increased out-of-band attenuation.

Growing community of inventors

Tokyo, Japan

Toshiyasu Fujiwara