Fujitsu Corporation

Ulvac, Inc.

Toshiya Yogo

Koukou Suu

Tomoyuki Mori

Masahisa Ueda

Takashi Kurimoto

Masaaki Yano

Atsushi Okuda

Kyuzo Nakamura

Michio Ishikawa

Kazushige Komatsu

Nobusuke Tachibana

An ashing device that prevents the ashing rate from changing over time. The ashing device ashes organic material on a substrate including an exposed metal in a processing chamber. The ashing device includes a path, which is formed in the processing chamber and through which active species supplied to the processing chamber pass. The path is defined by a surface on which the metal scattered from the substrate by the active species is collectible, with the surface being formed so as to expose a metal that is of the same kind.

Ashing device

Disclosed is an ashing apparatus and its method of manufacture wherein decrease in processing efficiency is suppressed. Specifically, a shower plate is arranged to face a substrate stage on which a substrate is placed, and diffuses oxygen radicals supplied into a chamber. A metal blocking plate is arranged between the shower plate and the substrate stage and has a through hole through which oxygen radicals pass. In addition, the metal blocking plate has a first layer, which is made of a metal same as the one exposed in the substrate, on the surface facing the substrate.

Ashing apparatus

A recording medium suitable for use in an impedance matching apparatus adapted to a waveguide transmitting a microwave to a load. The apparatus includes detecting diodes and a computer. The recording medium includes a program, which includes predetermined approximate expressions. The predetermined approximate expressions recorded in the program correspond to the detecting diodes. The program causes the computer to compute an approximation value of input power to the waveguide using the respective predetermined approximate expressions and output voltages of the detecting diodes. The program also causes the computer to compute coefficient of reflection and phase of the input power using the approximation value; determine whether impedances of the waveguide and the load match with each other based on the computed coefficient of reflection and phase of the input power; and execute automatic impedance matching of the impedance matching apparatus when the impedances of the waveguide and the load do not match with each other.

Apparatus and method for automatically matching microwave impedance

An E-H matching apparatus includes an E-plane branch waveguide connected to an E-plane of a waveguide body, an H-plane branch waveguide connected to an H-plane of the waveguide body, and plungers provided in the E-plane branch waveguide and the H-plane branch waveguide, respectively. The plungers are moved to establish impedance matching between the waveguide and a load. The H-plane branch waveguide has a bend portion formed in close proximity to the waveguide body.

E-H matching device and apparatus and method for automatically matching

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Kasugai, Japan

Toshiya Yogo