Mitsubishi Heavy Industries Limited

Thk Co., Ltd.

Kabushiki Kaisha Toshiba

National Institute of Advanced Industrial Science and Technology

Technology Research Association for Future Additive Manufacturing

Graphtec Kabushiki Kaisha

Toshiya Watanabe

Takeshi Kaneko

Satoshi Sakai

Saneyuki Goya

Minoru Danno

Takashi Ishide

Yoshikazu Matsuo

Shuji Tanigawa

Shinji Kawabata

Yuki Nomura

Hideo Yamakoshi

Ryuichi Narita

Yoshihito Fujita

Masato Kinouchi

Masashi Kitamura

Akio Kondou

Hidetaka Haraguchi

Makoto Yamasaki

Yoshimasa Endo

Tsugumaru Yamashita

Kenji Hidaka

Claus Thomy

Ryu Suzuki

Kohei Kanaoka

Toyoaki Yasui

Ichiro Nagano

Kenji Muta

Katsunori Akiyama

Haruhiko Niitani

Kouji Shimizu

Atsuhiro Iyomasa

Daisuke Kawabata

Misaki Fukuyama

Atsushi Takita

Yukio Kodama

Kouji Satake

Henry Koehler

Masakatsu Fujita

Masatoshi Noguchi

Fumiya Koizumi

Chiaki Yasuda

Michael Kalms

Taiji Kikuchi

Mitubu Yokoyama

Takayuki Numata

Toshiaki Monaka

A laser light profile measuring device of the present disclosure includes a reflection attenuation part reflecting and attenuating at least part of laser light incident from a first direction in a direction different from the first direction to generate measurement target laser light traveling in the first direction, a capture unit placed on one side of the reflection attenuation part in the first direction and which captures the measurement target laser light, a cooling body covering at least part of the reflection attenuation part and the capture unit in a circumferential direction with respect to the first direction, a refrigerant supply unit forcibly feeding a refrigerant toward the cooling body, and a rotation support part supporting the reflection attenuation part, the cooling body, and the refrigerant supply unit to be rotatable around a rotation axis extending in a horizontal direction.

Laser light profile measuring device and laser light profile measuring method

An object of the present invention is to ascertain parts of an object that are approachable by finger portions of a hand mechanism. In an image information processing device, a housing container is retrieved from an image by using a first retrieval frame, and an object is retrieved from the image by using a second retrieval frame. A plurality of determination points are set in advance on the second retrieval frame, and a predetermined approach direction is set for each determination point. A determination is then made as to whether or not the finger portions of the hand mechanism can be caused to approach parts of one object, existing within the second retrieval frame, that correspond respectively to the determination points set on the second retrieval frame from the predetermined approach directions set in relation to the determination points.

Image information processing device, gripping system, and image information processing method

An internal defect detection system for a three-dimensional additive manufacturing device which performs additive molding by emitting a laser beam to a powder bed is provided. This system specifies a candidate position of an internal defect on the basis of a change amount of a local temperature measured in an irradiated part of a powder bed irradiated by a laser beam. The system calculates a cooling speed at the candidate position on the basis of a temperature distribution and determines whether an internal defect exists on the basis of the cooling speed.

Internal defect detection system, three-dimensional additive manufacturing device, internal defect detection method, method of manufacturing three-dimensional additive manufactured product, and three-dimensional

Provided are a machining device (), a machining unit, and a machining method that irradiate a workpiece () with a laser beam to perform cutting or boring machining of the workpiece (). The invention has a laser output device (), a guiding optical system () that guides a laser beam, and an irradiating head () that guides a laser beam and irradiates the workpiece () with the laser beam. The irradiating head () integrally rotates a first prism () and a second prism () with a rotation mechanism, thereby rotating a light path of the laser beam around a rotational axis of the rotation mechanism and irradiating the workpiece () while rotating the position of irradiation to the workpiece. A control device () calculates an allowable rotational frequency range of the laser beam on the basis of the relationship between an allowable thickness of a remelted layer of the workpiece () and a rotational frequency, or the relationship between an allowable thickness of an oxidization layer of the workpiece and the rotational frequency, determines a rotational frequency included in the allowable rotational frequency range as the rotational frequency of the rotation mechanism, and rotates the rotation mechanism at the determined rotational frequency, thereby enabling high-precision machining to be performed with a simple configuration.

Machining device, machining unit, and machining method

A hand mechanism grips an object more favorably, regardless of the attitude and surrounding conditions of the object. When an object is to be gripped by a hand mechanism having three or more finger portions, at least one finger portion among the three or more finger portions functions as a state-altering finger portion for altering the attitude or the position of the object while contacting the object, and at least two finger portions among the finger portions other than the finger portion functioning as the state-altering finger portion function as gripping finger portions for gripping the object in a state where the attitude or the position has been altered by the state-altering finger portion.

Hand mechanism, gripping system, and non-transitory storage medium

A three-dimensional additive manufacturing device is configured to emit a beam to a powder bed formed by laying a powder on a base plate to harden the powder bed selectively. A sensor is configured to detect the shape or the temperature of a surface of the powder bed or a modeling surface. A defect in laying of the powder or a defect in emission of the beam is corrected based on the detection result, before completion of forming of the next layer.

Three-dimensional additive manufacturing device, three-dimensional additive manufacturing method, and three-dimensional additive manufactured product

A gripping system for gripping an object using a hand mechanism having at least two finger portions includes a specification unit that specifies a contactable portion and an unexposed portion, the contactable portion being a portion of the object that can be contacted by at least a first finger portion constituting one of the finger portions and the unexposed portion being a portion that is not exposed at the time of the determination, a first operation control unit that exposes the unexposed portion of the object, and a second operation control unit that grips the object in a state where the unexposed portion is exposed by bringing the first finger portion or the second finger portion into contact with the unexposed portion and bringing a finger portion other than the finger portion contacting the unexposed portion into contact with a predetermined surface of the object other than the unexposed portion.

Gripping system

A process abnormality detection system for a three-dimensional additive manufacturing device which performs additive modeling by emitting a beam to a powder bed determines that a laying abnormality of the powder bed is occurring if at least one of a first condition that an average height of the powder bed from a reference position is out of a first predetermined range or a second condition that a height variation of the powder bed is out of a second predetermined range is satisfied, on the basis of a detection result of a shape measurement sensor.

Process abnormality detection system for three-dimensional additive manufacturing device, three-dimensional additive manufacturing device, process abnormality detection method for three-dimensional additive manufacturing device, method for manufacturing three-dimensional additive manufactured product, and three-dimensional additive manufactured product

A laser machining device includes a laser machining head and a control unit. The laser machining head applies laser for machining an object to be machined, and includes a first laser light source for first laser, a second laser light source for second laser having a different pulse width different from the first laser, a condensing optical system provided between the object and the laser light sources to condense at least the lasers on the object, a switch mechanism provided between the condensing optical system and the laser light sources so that the switch mechanism is movable to a position that at least one of the lasers enters the condensing optical system, and an irradiation angle change mechanism provided between the condensing optical system and the switch mechanism to change an irradiation angle of the first laser. The control unit controls the laser machining head.

Laser machining device and laser machining method

Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.

Laser processing method and laser processing apparatus

Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser oscillator having a plurality of vertical cavity surface-emitting laser diode chips that output laser light having a wavelength of 1,070 nm or less, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix; a guidance optical system that guides the laser light output from the laser oscillator; and a control device that controls the output of the laser oscillator.

Processing device and processing method

This invention is directed to attenuating a beam output without changing the beam position and the beam diameter. A high-output optical attenuator includes a first reflector that totally reflects incident light and causes first reflected light serving as reflected light of the incident light to enter a second reflecting portion, a second reflector that reflects the first reflected light and causes second reflected light serving as reflected light of the first reflected light to enter a third reflecting portion, a third reflector that reflects the second reflected light and causes third reflected light serving as reflected light of the second reflected light to enter a fourth reflecting portion, and a fourth reflector that reflects the third reflected light as fourth reflected light having the same optical axis as the optical axis of the incident light. At least two of the second reflector, the third reflector, and the fourth reflector are half mirrors.

High-output optical attenuator, measurement device, and 3D shaping apparatus

A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation headand a control device. The irradiation headincludes a laser turning unitand a condensing optical system. The laser turning unitincludes a first prism, a second prism, a first rotating mechanism, and a second rotating mechanism. The control device adjusts the differences between rotation speeds and phase angles of the first prismand the second prismbased on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.

Processing apparatus and processing method

Provided are a machining device and a machining method in which machining of higher precision can be performed with a simple configuration. The machining device has an irradiation head () and a controller; and the irradiation head () can be divided into a collimate optical system, a laser revolving unit (), and a light collection optical system (). The laser revolving unit () has a first prism (), a second prism (), a first rotation mechanism (), and a second rotation mechanism (). The controller controls the rotational speeds and the difference in phase angles of the first prism () and the second prism (), on the basis of at least the relationship between a heat affected layer of a member to be machined and the revolving speed of the laser.

Machining device and machining method

A surface coating film includes, a base material which is a hard material; and an oxidation-resistance coating layer containing, as a main component, a complex oxide of Li and at least Al and covering a surface of the base material. Further, a method of manufacturing a surface coated member, includes, supporting a base material which is a hard material in a hermetic container with the use of a holder arranged in the container; arranging a complex oxide forming target containing Li and at least Al, as main components, in the container; feeding oxygen into the container; and forming an oxidation-resistance coating layer that covers the base material to obtain the surface coated member by effecting electric discharge between the complex oxide forming target as an anode and the holder as a cathode.

Surface coating film, method of manufacturing thereof, cutting tool and machine tool

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Tokyo, Japan

Toshiya Watanabe