Hitachi, Ltd.

Renesas Technology Corp.

Hitachi Plant Technologies, Ltd.

Toshiya Teramae

Koji Hayashi

Junichi Saeki

Kazutoshi Yanagihara

Tetsuya Yagami

Ryouichi Kataoka

Shuichi Suzuki

Yuji Enomoto

Yoshihisa Ishikawa

Keii Ueno

Yohei Asakawa

Osami Kaneto

Yasuharu Ichinose

Takahiro Makiyama

Plural saddle shape patches are formed on a blank material for forming a blade using a manufacturing apparatus provided with a punch support having punches each with a holder attached to be opposite with one another at a predetermined interval corresponding to a thickness of the blank material. The punch support is mounted to a second ram via a second rotational mechanism which is rotatable in a direction in which the ram moves. The die is attached to the first ram via the first rotational mechanism. The actuator controls the rotating angles of both the rotational mechanisms.

Blade, impeller, turbo fluid machine, method and apparatus for manufacturing blade

There is provided a controlling technique for a servo press capable of optimal forming for handling variability in a sheet thickness and material property of a workpiece and for handling each workpiece. A controlling device for controlling a servo press in accordance with a slide motion data includes: measurement equipment for measuring a forming state of a workpiece, attached to a die for forming the workpiece; a measurement result receiving portion for receiving a measurement result sent from the measurement equipment; and a slide motion data changing portion for changing a slide motion data for forming the same workpiece at scheduled measuring time in accordance with the measurement result received by the measurement result receiving portion.

Controlling device for servo press and servo press equipped with the controlling device

A claw-pole type dynamo-electric machine, from which an improvement in productivity of stator winding can be expected, has such as a structure that the whole stator wiring is covered with a magnetic body, and thereby the inductance increases to pose the problem of decreasing a power factor. Disclosed is a stator core of a dynamo-electric machine in which a plurality of stator cores of respective phases are arranged independently in the direction of the rotating shaft of a rotor, the magnetic poles of the stator cores are arranged in the shape of a wave in the circumferential direction of the rotating shaft of a rotor, slots extending in the direction of the rotating shaft are formed between respective magnetic poles, and the stator winding can be arranged in a slot formed on the side of the inner end face of the magnetic pole arranged in the shape of a wave and in the axial direction of the rotating shaft.

Stator core for dynamo-electric machine and manufacturing method therefor

A design support apparatus including: a flow analyzer for analyzing a flow of thermosetting resin injected into a resin filling cavity to mold a resin mold product made of the thermosetting resin, using a finite difference method or a finite element method; a residual strain calculator for calculating residual strain (or stress) of the thermosetting resin after heat shrinkage of the thermosetting resin injected into the resin filling cavity to mold the resin mold product; and a strength analyzer for analyzing strength of the resin mold product, using a finite element method. According to this arrangement, strength of the resin mold product made of the thermosetting resin can be predicted accurately.

Design support apparatus and method for supporting design of resin mold product

A small semiconductor package having two electrodes, which can be produced at reduced cost and which features high reliability. The package has a structure in which an anode and a cathode are arranged on one surface of a semiconductor chip, each electrode having a bump electrode for connecting the electrode to an external substrate. An insulating resin is provided on the surface of the semiconductor chip and on the surfaces of the bump electrodes, except at least for the connection portions to the external substrate.

Diode package having an anode and a cathode formed on one surface of a diode chip

Growing community of inventors

Hiratsuka, Japan

Toshiya Teramae