Konica Minolta, Inc.

Konica Minolta Opto, Inc.

Toshiya Takitani

Shigeru Hosoe

Akihiro Fujimoto

Kenji Ogiwara

Yuiti Fujii

Shinobu Suga

Yosuke Aoki

Kenji Hamada

A head-up display device includes: an image generator that emits light; and a display member including: a projection surface onto which the light is projected, wherein when the light is emitted to the projection surface, the light is reflected from the projection surface to display a real image passing through the display member and a virtual image; and a plate material including: a pair of optical surfaces, one positioned nearer to an observer side than the other, and either of which can serve as the projection surface; an end surface connecting peripheries of the pair of optical surfaces; and an end main surface formed at a predetermined a distance from the end surface to a reference line passing through a reference point and being orthogonal to a tangent plane at the reference point.

Head-up display device

The aim is to regulate thickness on the optical axis in the production of wafer lenses. Disclosed is a wafer lens production method that is equipped with a dispensing process for dropping resin onto a molding die (), an imprinting process for pressing either the molding die () or a glass substrate () toward the other, and a releasing process for releasing the glass substrate () from the molding die (), and that repeats the processing from the dispensing process to the releasing process as a single cycle and successively forms resin lenses () on the glass substrate); wherein the height (A) of the non-lens area () surrounding the lenses () and the heights (B and C) of the glass substrate () are measured between the releasing process of a first cycle and the dispensing process of a second cycle, and the position of the molding die () is corrected for imprinting processes of the second cycle, on the basis of the heights (A-C).

Production method of wafer lens

Growing community of inventors

Sakai, Japan

Toshiya Takitani