Sanyo Electric Co., Ltd.

Toshiya Shimizu

Yasuhiro Kohara

Kiyoshi Shibata

Yasuhiro Asai

Takashi Seto

Ryosuke Usui

Hideki Mizuhara

Masayuki Nagamatsu

Hajime Kobayashi

Nobukazu Yamanishi

Yoshiyuki Furukoji

Daiki Uchiyama

A power supply device comprises plural battery cells having electrode portions, and bus bars connecting the electrode portions of the plural battery cells each other. The bus bar comprises a thin portion thinner than the other portion formed in at least one part of the end edge of the bus bar, and are welded to the electrode portion of the battery cell through the thin portion. The electrode portion comprises a pedestal portion, and an electrode terminal projecting from the pedestal portion, and the thin portion is disposed at the side surface of the electrode terminal. By this, at the time of welding the bus bar the thin portion is directly welded to the electrode portion, and without using other parts of the welding ring or the like the welding process is streamlined.

Power source device, electric vehicle comprising power source device, accumulator device

An assembled battery comprises: multiple cellseach having external terminals including a negative electrode terminaland a positive electrode terminal; a bus barwhich connects the external terminal of one of two adjacent cellsand that of the other thereof; an electrically-conductive connecting memberwhich connects the external terminal and the bus barby welding to the external terminal and the bus bar; a welding portionwelded to the bus barand the connecting member; and a welding portionwelded to the external terminal and the connecting member. The connecting membercomprises an intervening portionconnected to the welding portion, and a main body portionextending from the intervening portionto the welding portion. The intervening portionhas a thickness that is smaller than that of the main body portion

Assembled battery and cell connection method

The invention provides a solder structure which is least likely to develop Sn whiskers and a method for forming such a solder structure. The solder structure includes an Sn alloy capable of a solid-liquid coexistent state and an Au (or Au alloy) coating covering at least part of the surface of the Sn alloy. The Au covering is a film that covers and coats at least part of the surface of the Sn alloy. As a preferable mode, the Au coating forms a netlike structure on the surface of the Sn alloy. The thickness of the Au coating is, for instance, 1 to 5 &#x3bc;m.

Solder structure, method for forming the solder structure, and semiconductor module including the solder structure

Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.

Circuit board and circuit device

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Mizuho, Japan

Toshiya Shimizu