Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Ricoh Company, Ltd.

Renesas Technology Corp.

Hitachi Koki Co., Ltd.

Hitachi Astemo Ltd.

Toshiya Satoh

Kinya Nakatsu

Takeshi Tokuyama

Masahiko Ogino

Ryuichi Saito

Asao Nishimura

Akira Nagai

Hideki Miyazaki

Ichiro Anjo

Nobutake Tsuyuno

Hiroshi Hozoji

Toshiaki Ishii

Takao Miwa

Haruo Akahoshi

Takanori Ninomiya

Shuji Eguchi

Ichiro Anjoh

Teruaki Mitsuya

Takashi Suzuki

Hideki Tanaka

Daisuke Tomita

Naohiro Toda

Takashi Namekawa

Kazuhiro Suzuki

Nobuo Iwata

Akio Takahashi

Akihiro Yaguchi

Yuichi Satsu

Tadashi Shinohara

Toshihide Nabatame

Toru Miyasaka

Hiroyoshi Kokaku

Yuji Arai

Hiroshi Ono

Hiroyuki Nagashima

Takashi Naito

Hiroki Yamamoto

Toshio Koike

Takumi Ueno

Keisuke Horiuchi

Yusuke Takagi

Tsuneaki Kawanishi

Ryuuichi Shimizu

Hiroyuki Uenishi

Akira Asaoka

Takeshi Matsuo

Hirotaka Hatta

Yoshihide Yamaguchi

Eiichi Ide

Takeshi Kojima

Shinichi Fujino

Atsushi Kazama

Takashi Naitou

Kenji Honjoh

Hiroyuki Tenmei

Katsunori Azuma

Shigehisa Motowaki

Shinji Yamada

Yutaka Shio

Satoshi Hatori

Ken Amemiya

Ken Takahashi

Noriyuki Maekawa

Masahiko Saito

Kazuhiro Wakamatsu

Takao Ishikawa

Toshiaki Morita

Nobuo Kuwabara

Masahiko Shakuto

Atsushi Sampe

Yoshikane Matsumoto

Takeshi Fukao

Tokihito Suwa

Takashi Hirao

Takuya Fukuda

Satoru Amou

Akira Matsushita

Takahiro Shimura

Michiaki Hiyoshi

Hiroyuki Tadokoro

Fusanori Nishikimi

Michiya Okamoto

Fumihito Itoh

Yutaka Misawa

Keisuke Yuasa

Akira Shimada

Junpei Kusukawa

Seikichi Tanno

Naohiro Momma

Shigeru Takahashi

Akihiro Namba

Yasutaka Suzuki

Yusuke Ishizuka

Shigeo Amagi

Katsumi Kumada

Michio Ohue

Masahiko Asano

Tetsuya Ohba

Mitsuhiro Masuda

A coating device includes a coating roller configured to rotate in a rotation direction to apply a treatment liquid onto a sheet at an application position, and a contacting member in contact with a peripheral surface of the coating roller at a position downstream of the application position in the rotation direction.

Coating device, liquid discharge apparatus, and printer

No consideration is given to heat transferred from a semiconductor module to a capacitor via a bus bar module. The heat generated by a semiconductor module () is transferred to a bus bar module () via a DC terminal (A) of the semiconductor module (). As illustrated in FIG.(B), the heat transferred to the bus bar moduleis then transferred to the pressing membervia the annular conductorand the boltA. Since the pressing memberis in close contact with the second coolerB, the heat transferred to the pressing memberis cooled by the second coolerB. On the other hand, the heat transferred to the convex portionA of the housingis transferred to the first coolerA via the housingand cooled. As a result, in the configuration in which a capacitor () is connected to the semiconductor module () via the bus bar module (), the heat transferred from the semiconductor module () to the capacitor () can be suppressed.

Power conversion device and motor-integrated power conversion device

A liquid discharge apparatus includes a head including a supply path and a discharge path circulating a liquid in a liquid circulation direction, the head configured to discharge the liquid, a circulation path coupled to the head, the liquid circulates through the head in the circulation path, a bypass coupled to a downstream end of the supply path of the head and an upstream end of the discharge path of the head in the liquid circulation direction, a pressure generator configured to generate and apply a circulation pressure to the liquid circulating through the circulation path, and a deaerator configured to remove gas in the liquid circulating the circulation path.

Liquid discharge apparatus, and liquid discharge method

An image forming apparatus includes an image forming device, a rotatable conveying member, and a suction device. The image forming device forms an image on a continuous recording medium. The conveying member has a hollow drum shape. The conveying member conveys the continuous recording medium. The suction device is disposed inside the hollow drum shape of the conveying member. The suction device sucks the continuous recording medium through the conveying member in a fixed region in which the continuous recording medium and the conveying member are in contact with each other.

Image forming apparatus

A device includes a temperature control member and a linearly-contact member. The temperature control member has an outer peripheral surface to contact a conveyed substrate to which liquid is applied, and heats or cools the substrate. The linearly-contact member contacts the substrate and the temperature control member on an upstream side from a contact position between the substrate and the temperature control member in a conveyance direction of the substrate.

Device and liquid discharge apparatus

An apparatus according to one aspect of the present disclosure includes a temperature controlling member configured to heat or cool a conveyed substrate to which a liquid is applied, the conveyed substrate contacting an outer peripheral surface of the temperature controlling member; and an upstream inlet air unit configured to draw air between the substrate and the temperature controlling member, the upstream inlet air unit being provided upstream of a contact location of the substrate with the temperature controlling member, in a conveying direction.

Apparatus, inlet air unit and liquid discharging apparatus

An object of the present invention is to ensure the reliability of a capacitor element by appropriately securing a heat path around the capacitor element. A power converter according to the present invention includes: a power semiconductor circuit unit that converts DC power into AC power; a capacitor element that smooths the DC power; a DC-side bus bar that transmits the DC power; a capacitor terminal that is connected to an electrode surface of the capacitor element and to the DC-side bus bar; and a case that forms a capacitor housing portion for housing the capacitor element, in which the DC-side bus bar has: a power supply-side terminal; a main body portion that is arranged at a position facing a bottom of the capacitor housing portion with the capacitor element interposed therebetween; and an extending member that is formed between the case and the capacitor element and formed from the main body portion toward the bottom of the capacitor housing portion, and that does not contact the electrode surface.

Power converter

A power module includes a double-sided electrode module, a power semiconductor element, a pair of base plates, and a connecting member. The double-sided electrode module has a plurality of electrode wiring boards and a power semiconductor element which are molded with a resin material. The pair of base plates has the double-sided electrode module sandwiched therebetween. The pair of base plates are connected via the connecting member. The connecting member is formed in a curved shape.

Power module, power converter device, and electrically powered vehicle

An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Electric power conversion apparatus

A power converter device includes a double-sided electrode module in which an electrical wiring board and a power semiconductor element are molded with a resin material. The power converter device also includes a heat dissipating base disposed on both sides of the double-sided electrode module and directly contacting cooling medium. The power converter device also includes a module fixture which presses the heat dissipating base in a state of contact with the heat dissipating base. The module fixture is configured to support a circuit board.

An object of the present invention is to reduce wire inductance without damaging manufacturability of a power converter. A power converter according to the present invention includes a power semiconductor module, a capacitor, and DC bus bars and. The capacitor smooths a DC power. The DC bus bars and transmit the DC power. The DC bus bars and include a first terminal and a second terminal. The first terminal connects to the power semiconductor module. The second terminal connects to the capacitor. The DC bus bars and form a module opening portion to insert the power semiconductor module. The DC bus bars and form a closed circuit such that a DC current flowing between the first terminal and the second terminal flows to an outer periphery of the module opening portion.

An electronic component has a semiconductor element and a thermally conductive support member. A heat sink is disposed on one surface of the circuit body, and a thermally conductive insulating member is interposed between the heat sink and the support member. Input and output terminals and a ground terminal are also provided. A sealing resin is formed to expose a part of each of the input and output terminals and the ground terminal and one surface of the heat sink, and to cover a periphery of the electronic component structure. A main body conductor layer is formed to be insulated from the input and output terminals and cover an immersion region of the sealing resin and one surface of the heat sink immersed in a cooling medium. A ground conductor layer covers at least a part of the ground terminal and is electrically connected with the main body conductor layer.

Electronic device and method of manufacturing the electronic device

An object of the present invention is to achieve both low height and miniaturization of a double side cooling type electric power conversion device. A power semiconductor module according to the present invention includes: a circuit body including a power semiconductor device and a terminal; and a case forming an accommodation space for accommodating the circuit body, wherein the case includes: a first heat radiation portion and a second heat radiation portion disposed to face each other sandwiching the accommodation space; a first opening that is disposed at a side portion to the first heat radiation portion and through which the terminal passes; a sealing surface formed to surround the first opening; and a reference surface disposed at a side portion to the second heat radiation portion, and the reference surface is formed on a surface opposite to a surface on which the sealing surface of the case is disposed such that, when projection is performed from a vertical direction of the reference surface, a projection of the reference surface and a projection of the sealing surface overlap each other.

Power semiconductor module and electric power conversion device

An object of the invention is to improve the cooling performance for a bus bar and a smoothing capacitor in an electric power converter. The electric power converter of the present invention includes a power semiconductor module including a power semiconductor element that converts a DC current to an AC current, a capacitor cell that smooths a DC voltage, a bus bar that electrically connects the power semiconductor module and the capacitor cell, a base plate that is disposed between the bus bar and the capacitor cell, and a sealing material that seals the capacitor cell, the bus bar, and the base plate. The base plate forms an opening through which a capacitor terminal extending from the capacitor cell passes.

Electric power converter

Growing community of inventors

Hitachiota, Japan

Toshiya Satoh