Hitachi, Ltd.

Renesas Technology Corp.

Toshiya Sato

Motoyuki Suzuki

Takashi Naito

Hiroki Yamamoto

Atsushi Saito

Ken Takahashi

Masahiko Saito

Takao Ishikawa

Toshiaki Morita

Takashi Namekawa

Takao Miwa

Masashi Yamamoto

Yasutaka Suzuki

Shigehisa Motowaki

Tadanori Segawa

Tetsuro Akasaki

Osamu Shiono

Daigoro Kamoto

Yoshimasa Takahashi

Katsuhiro Higuchi

Masahiro Nakano

Koichi Niwa

Hiroshi Houzouji

Hidekazu Nishidai

Jin Sawahata

A semiconductor device in which the lifetime of mounted components can be prolonged. A cooling system for controlling the temperature of a refrigerant through a heating section and a radiator is provided. The semiconductor device is connected to the cooling system and is cooled. A variation width (&#x394;T) of temperature controlled by the cooling system through the heating section and the radiator is smaller than a temperature variation (&#x394;T) of the refrigerant caused by variations in operating conditions of the semiconductor device (&#x394;T&#x2266;&#x394;T).

Semiconductor device

A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon and electrically connecting a plurality of connection terminals arranged in intervals different from intervals of the holes to the conductive material. The shape of the conductive material is porous and porous electrodes are bonded to the inner wall surfaces of the holes by an anchor effect to increase the strength of the glass substrate.

Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate

An intermediate transfer unit is constructed by covering a conductive cylindrical base member of drum-shape with an elastic member of belt-shape, the elastic member of belt-shape being adhesively fixed to the base member with an adhesive agent, grooves or pits being provided on the surface of the cylindrical base member, the elastic member of belt-shape being adhesively fixed by the adhesive agent filled in the grooves or pits. The adhesive agent has a resistivity smaller than at least the resistivity of the elastic member of belt-shape. By doing so, it is possible to construct and keep the uniform distribution of resistivity without change by environment and deterioration with age, and to realize proper transferring. Furthermore, since the diametrical change of the drum due to uneven application of the adhesive agent can be minimized, the effect on misalignment in color can be minimized.

Image transfer element in a color image forming apparatus

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Hitachi, Japan

Toshiya Sato