Murata Manufacturing Co., Ltd.

Toshiya Sasaki

Masahiko Kawaguchi

Kazuyoshi Uchiyama

Keishiro Amaya

Eita Tamezawa

Katsuji Matsuta

Katsuhiro Misaki

A small size electronic component has a small direct current resistance value of a conductor pattern and minimal dimensional irregularity of a conductor pattern. In order to form such a component, a photosensitive conductive paste applied on a ceramic substrate and is then exposed through a photo mask and developed so as to form a lower conductor pattern layer of a coil conductor pattern. Then an insulating paste is applied on the ceramic substrate so as to cover the lower conductor pattern layer and the insulating paste is removed with a solvent until at least the upper surface of the lower conductor pattern layer is exposed so as to form an inter-line insulating layer. Furthermore, after applying a photosensitive conductive paste as a film, the exposure and development operation is conducted again while using the photo mask so as to form an upper conductor pattern layer on the lower conductor pattern layer.

Method of manufacturing an electronic component including an inter-line insulating layer and a conductor pattern

A small size electronic component has a small direct current resistance value of conductor pattern and minimal dimensional irregularity of a conductor pattern. In order to form such a component, a photosensitive conductive paste applied on a ceramic substrate and is then exposed through a photo mask and developed so as to form a lower conductor pattern layer of a coil conductor pattern. Then an insulating paste is applied on the ceramic substrate so as to cover the lower conductor pattern layer and the insulating paste is removed with a solvent until at least the upper surface of the lower conductor pattern layer is exposed so as to form an inter-line insulating layer. Furthermore, after applying a photosensitive conductive paste as a film, the exposure and development operation is conducted again while using the photo mask so as to form an upper conductor pattern layer on the lower conductor pattern layer.

Electronic component having a coil conductor with photosensitive conductive paste

A method of manufacturing an electronic component includes forming a slit in a connecting electrode located on the surface of a mother substrate such that the slit extends in a direction intersecting a cutting line, and cutting the mother substrate along the cutting line while cutting the connecting electrode having the slit. The connecting electrode is thereby reliably exposed on two opposing cut surfaces, and the reliability of external connection of the electronic component is improved.

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Takefu, Japan

Toshiya Sasaki