Merck Patent Gmbh

Az Electronic Materials (luxembourg) S.a.r.l.

Toshiya Okamura

Tetsuo Okayasu

Thorsten Vom Stein

Rikio Kozaki

Masato Suzuki

Go Noya

Yuki Ozaki

Tomohide Katayama

Noboru Satake

Naoko Nakamoto

Hiroshi Hitokawa

Issei Sakurai

Yoshio Nojima

Takashi Kanda

Hiroyuki Aoki

Bertram Bernd Barnickel

Naotaka Nakadan

Katsuchika Suzuki

Bertram Barnickel

Tomotsugu Yano

Rui Zhang

Aritaka Hishida

Masahiko Kubo

Bernd Bertram Barnickel

To provide a novel polymer capable of reducing sublimate during film formation and a composition comprising the same. The polymer (A) according to the present invention comprises at least one structural unit selected from the group consisting of Unit (a), Unit (b), Unit (c) and Unit (d) having certain structures, wherein, n, n, nand n, which are the numbers of repetition respectively of Units (a), (b), (c) and (d), satisfy the following formulae: n+n>0, n≥0 and n≥0.

Polymer, semiconductor composition comprising polymer, and method for manufacturing film using semiconductor composition

[Problem] To provide a polycarbosilazane making it possible to form a silicon-containing film which is bearable to acid etching, and a composition comprising the polycarbosilazane. [Means for Solution] The present invention provides a polycarbosilazane comprising a repeating unit of —[RRSi—(CH)]— and —(RRSi—NR)—, wherein R, R, Rand Rare each independently a single bond, hydrogen or Calkyl; Ris independently a single bond or hydrogen; and n is 1-2, and a composition comprising the polycarbosilazane. The present invention also provides a method for forming a silicon-containing film, comprising coating the composition above a substrate and heating.

Polycarbosilazane, and composition comprising the same, and method for producing silicon-containing film using the same

To provide a new silicon-containing polymer making it possible to form a cured film has features that its residual stress is small and crack resistance is high. A polycarbosilazane having particular cyclic structures.

[Problem] To provide a film forming composition curable at low temperature and a film forming method using the same. [Means for Solution] A film forming composition comprising a polysilazane, an organic solvent and aspecific additive, and a film forming method comprising applying it on a substrate and curing. The specific additive is selected from the group consisting of (A) guanidines substituted by a hydrocarbylgroup, (B) crown ether amines containing oxygen and nitrogen as a member thereof, (C) cycloalkanes having an amino-substituted polycyclic structure, (D) oximes substituted by a hydrocarbyl group, and (E) imidazolines.

Film forming composition

[Problem] To provide a composition comprising polycarbosilane, which has excellent filling property, can form a film at a lower temperature, and makes electrical property of the produced film excellent. [Means for Solution] A silicon carbonaceous film forming composition comprising polycarbosilane and a solvent, wherein the ratio of the integrated intensity at 3.92 to 4.20 ppm to the integrated intensity at 3.60 to 5.50 ppm in the H-NMR spectrum of said polycarbosilane is 27 to 50%.

Silicon carbonaceous film forming composition comprising polycarbosilane and method for manufacturing silicon carbonaceous film using the same

To provide a siloxazane compound capable of shortening the time of a siliceous film producing process and a composition comprising the same. A siloxazane compound having a specific structure, wherein the ratio of the number of O atoms to the total number of O atoms and N atoms is 5% or more and 25% or less, and in the spectrum of the siloxazane compound obtained bySi-NMR in accordance with the inverse gate decoupling method, the ratio of the area of the peak detected in &#x2212;75 ppm to &#x2212;90 ppm is 4.0% or less to the area of the peak detected in &#x2212;25 ppm to &#x2212;55 ppm; and a composition comprising the same.

Siloxazane compound and composition comprising the same, and method for producing silceous film using the same

[Problem] To provide a perhydropolysilazane making it possible to form a siliceous film with minimal defects, and a curing composition comprising the perhydropolysilazane. [Means for Solution] The present invention provides a perhydropolysilazane having a weight-average molecular weight of 5,000 to 17,000, characterized in that whenH-NMR of a 17% by weight solution of said perhydropolysilazane dissolved in xylol is measured, the ratio of the amount of SiHbased on the aromatic ring hydrogen content of the xylol is 0.235 or less and the ratio of the amount of NH based on the aromatic ring hydrogen content of the xylol is 0.055 or less, and a curing composition comprising the perhydropolysilazane. The present invention also provides a method for forming a siliceous film, comprising coating the curing composition on a substrate and heating.

Perhydropolysilazane, composition containing same, and method for forming silica film using same

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Kakegawa, Japan

Toshiya Okamura