Kabushiki Kaisha Toshiba

Fujitsu Corporation

Toshiya Kato

Masanori Fukushi

Motohiro Enkaku

Shinsuke Takase

Terushige Arai

There is provided a servo information recording device having a simple structure, being implementable in lower cost, and capable of writing servo information with high reliability and a servo information recording method. The servo information recording device includes a head swingably supported relative to a predetermined swing axis and a head drive section that swings the head within a predetermined zone in the radial direction of the disk medium. The device also has a controller that controls the head drive section and writes the servo information onto a track of the disk medium. Assuming that R is the outer circumferential radius of the disk medium and P is a distance between the center of the disk medium and pivot (swing axis), the swing axis is disposed at a position at which P/R falls beyond about 1.35.

Servo information recording device and servo information recording method

The method of positioning a disk-shaped medium is capable of precisely positioning the center of the disk-shape medium with respect to a center of a rotary shaft. The method comprises the steps of: inserting a cylindrical hub into a center hole of the disk-shaped medium; and covering a hub adaptor, which is eccentrically fixed to a rotary shaft, with the hub so as to position the disk-shaped medium on the rotary shaft. Directions of eccentricity of the disk-shaped medium, the hub and a hub unit are defined on the basis of amount of eccentricity between the disk-shaped medium and the hub, that between the hub and the hub adaptor and that between the hub adaptor and the rotary shaft.

Method of positioning disk-shaped medium

According to this invention, there is disclosed a semiconductor device in which a memory section and a logic section are arranged on the same semiconductor chip, comprising a high-resistance element constituting a memory cell, a low-resistance line connected to the high-resistance element, a power source line serving as a power source path from a power source pad, a switching element arranged between the low-resistance line and the power source line, and a control circuit for controlling the switching element.

Semiconductor memory device having electrically isolated memory and

A semiconductor integrated circuit device of multi-layer interconnection structure includes a pad formed of a multilayer interconnection layer. The power source pad is connected to a power source interconnection layer via a lead-out interconnection layer which is formed of the same multilayer interconnection layer as that used to form the power source pad.

Semiconductor integrated circuit device of multilayer interconnection

A semiconductor device includes a circuit block formed on a semiconductor chip with multilayered wiring layers having two or more layers, and having a specific function assigned thereto, a first current path pattern formed in a first layer of the multilayered wiring layers and running around the circuit block, a second current path pattern formed in a second layer of the multilayered wiring layers and running around the circuit block, part of the second current path pattern lying over the first current path pattern and the other portion of the second current path pattern lying off the first current path pattern so as to define a connection space with a predetermined width between the first current path pattern and the second current path pattern, a first signal path pattern formed in the first layer of the multilayered wiring layers and serving as a signal path to the circuit block, a second signal path pattern formed in the second layer of the multilayered wiring layers and serving as the signal path to the circuit block, and a via contact, formed in the connection space, for electrically coupling the first signal path pattern and the second signal path pattern.

Growing community of inventors

Kawasaki, Japan

Toshiya Kato