Dowa Metaltech Co., Ltd.

Toshiya Kamada

Akira Sugawara

Takashi Kimura

Weilin Gao

Fumiaki Sasaki

Motohiko Suzuki

A copper alloy sheet material comprises (by mass %) from 2.50 to 4.00% in total of Ni and Co, from 0.50 to 2.00% of Co, from 0.70 to 1.50% of Si, from 0 to 0.50% of Fe, from 0 to 0.10% of Mg, from 0 to 0.50% of Sn, from 0 to 0.15% of Zn, from 0 to 0.07% of B, from 0 to 0.10% of P, from 0 to 0.10% of REM, from 0 to 0.01% in total of Cr, Zr, Hf, Nb and S, the balance Cu and unavoidable impurities. A number density of coarse secondary phase particles (particle diameter of 5 mm or more) is 10 per mmor less. A number density of fine secondary phase particles (particle diameter of from 5 to 10 nm) is 1.0&#xb7;10per mmor more. A Si concentration in the parent phase is 0.10% by mass or more.

High strength Cu&#x2014;Ni&#x2014;Co&#x2014;Si based copper alloy sheet material and method for producing the same, and current carrying component

A Cu&#x2014;Ni&#x2014;Co&#x2014;Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0&#xd7;10number/mmor more. A number density of fine second phase particles is not more than 5.0&#xd7;10number/mm. A number density of coarse second phase particles is 1.0&#xd7;10number/mmor more and not more than 1.0&#xd7;10number/mm. The material has crystal orientation satisfying the following equation (1):{200}/{200}&#x2267;3.0&#x2003;&#x2003;(1)wherein I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane on the sheet material sheet surface; and I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane in a pure copper standard powder sample.

Cu-Ni-Co-Si based copper alloy sheet material and method for producing the same

A Cu&#x2014;Ti based copper alloy sheet material contains, in mass %, from 2.0 to 5.0% of Ti, from 0 to 1.5% Ni, from 0 to 1.0% Co, from 0 to 0.5% Fe, from 0 to 1.2% Sn, from 0 to 2.0% Zn, from 0 to 1.0% Mg, from 0 to 1.0% Zr, from 0 to 1.0% Al, from 0 to 1.0% Si, from 0 to 0.1% P, from 0 to 0.05% B, from 0 to 1.0% Cr, from 0 to 1.0% Mn, and from 0 to 1.0% V, the balance substantially being Cu. The sheet material has a metallic texture wherein in a cross section perpendicular to a sheet thickness direction, a maximum width of a grain boundary reaction type precipitate is not more than 500 nm, and a density of a granular precipitate having a diameter of 100 nm or more is not more than 10number/mm.

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Tokyo, Japan

Toshiya Kamada