Ultramemory Inc.

Yokogawa Electric Corporation

Toshitugu Ueda

Naoki Ogawa

Kazuo Yamaguchi

Hiroshi Nakayama

Fusao Kohsaka

Toshi Iino

Yasuhiro Sakamaki

Kunio Kazami

Yoshiaki Kudou

A semiconductor device includes a plurality of memory chips laminated to each other, each of the memory chips include a first transmission/reception coil for communication by means of inductive coupling; first lead-out lines led out from both ends of the first transmission/reception coil; and a first transmission/reception circuit, which is connected to the first lead-out lines, and which inputs/outputs signals to/from the first transmission/reception coil. The semiconductor device is also provided with an interposer, which is disposed on one end in the laminating direction of the memory chips, and which has, for each of the memory chips: a second transmission/reception coil coupled to the first transmission/reception coil by means of inductive coupling; second lead-out lines led out from both ends of the second transmission/reception coil; and a second transmission/reception circuit, which is connected to the second lead-out lines, and which inputs/outputs signals to/from the second transmission/reception coil.

Semiconductor device

Semiconductor device with laminated semiconductor chips

A semiconductor device of the present invention is provided with a plurality of memory chips laminated to each other, each of said memory chips having: a first transmission/reception coil for communication by means of inductive coupling; first lead-out lines led out from both ends of the first transmission/reception coil; and a first transmission/reception circuit, which is connected to the first lead-out lines, and which inputs/outputs signals to/from the first transmission/reception coil. The semiconductor device is also provided with an interposer, which is disposed on one end in the laminating direction of the memory chips, and which has, for each of the memory chips: a second transmission/reception coil coupled to the first transmission/reception coil by means of inductive coupling; second lead-out lines led out from both ends of the second transmission/reception coil; and a second transmission/reception circuit, which is connected to the second lead-out lines, and which inputs/outputs signals to/from the second transmission/reception coil. The memory chips are disposed at positions where, in plan view, the first transmission/reception circuits overlap each other, and the first transmission/reception coils are disposed around the first transmission/reception circuits, said first transmission/reception coils being disposed at positions where the first transmission/reception coils do not overlap each other.

A multi-turn absolute encoder comprising a shaft angle encoder for measuring the turning angle of a rotating shaft, and a turn detector for detecting the number of turns of the rotating shaft, wherein the turn detector uses a magnetic bubble element for sequentially transferring magnetic bubbles in a pattern in accordance with a magnetic field generated by a permanent magnet turned by the shaft, and a detector to detect the number of turns of the shaft from the positions of the magnetic bubbles which are transferred in the pattern.

Revolution counter using a magnetic bubble device for multi-turn

Growing community of inventors

Tokyo, Japan

Toshitugu Ueda