Renesas Electronics Corporation

Toshitsugu Ishii

Naohiro Makihira

Hidekazu Iwasaki

Jun Matsuhashi

Fukumi Unokuchi

A manufacturing method of a semiconductor device includes a step of preparing a test object including a body for sealing a semiconductor chip and a lead terminal, a step of preparing a test socket including a first contact pin, and a step of electrically testing the semiconductor chip by contacting the first contact pin with the lead terminal. The lead terminal includes a lead upper surface located on an upper surface side of the body and a lead bottom surface located on an bottom surface side of the body. The lead terminal includes a protruding portion protruding from the body, and a connecting portion. The lead terminal further includes a bending portion that connects the protruding portion and the connecting portion. Then, in the electrical test step, the first contact pin is contacted with the lead bottom surface of the protruding portion.

Manufacturing method of semiconductor device and test socket for use in the same

A test apparatus includes a test board, a unit, and a probe pin housed in the unit. First and second tip portions of the probe pin have the same shape as each other. A first external terminal of a first semiconductor package is brought into contact with the first tip portion of the probe pin and the second tip portion thereof is brought into contact with the terminal of the test board, thereby performing an electrical test of the first semiconductor package. Then, the unit is turned upside down and rearranged in the test apparatus. Thereafter, a second external terminal of a second semiconductor package is brought into contact with the second tip portion of the probe pin and the first tip portion thereof is brought into contact with the terminal of the test board, thereby performing an electrical test of the second semiconductor package.

Method of manufacturing semiconductor device

An inspection terminal provided in a test device has a main body portion including a support portion that is curved; a plate-shaped portion integrally connected to the support portion and extending in a first direction; a tip portion integrally connected to the plate-shaped portion and having a larger dimension in a second direction intersecting with the first direction than that of the plate-shaped portion in the second direction; and a slit formed from the tip portion to the plate-shaped portion so as not to reach the support portion of the inspection terminal. The tip portion of the inspection terminal has a first contact portion and a second contact portion that are separated from each other by way of via the slit, and each contact portion is brought into contact with an external terminal of a semiconductor package, and an electrical test of the semiconductor package is performed.

A semiconductor device is manufactured at an improved efficiency. The method of the invention includes a step of carrying out an electrical test by bringing an external terminal electrically coupled to a semiconductor chip mounted on a semiconductor device into contact with a tip portion of a probe pin coupled to a test circuit and thereby electrically coupling the semiconductor chip to the test circuit. The probe pin has a tip portion comprised of a base material, a nickel film formed thereon, and a conductive film formed thereon and made of silver. The conductive film is thicker than the nickel film.

The present invention is directed to improve reliability of a semiconductor device. A semiconductor device manufacturing method includes: (a) a step of attaching a BGA having a solder ball to a socket for a burn-in test; and (b) a step of performing a burn-in test of the BGA by sandwiching the solder ball by conductive contact pins in the socket. The contact pin in the socket has a first projection part which is conductive and extends along an attachment direction of the BGA and a second projection part which is conductive, provided along a direction crossing the extension direction of the first projection part, and placed so as to face the surface on the attachment side of the BGA of the solder ball. In the step (b), a burn-in test of the BGA is performed in a state where the first projection parts in the contact pins are in contact with the solder ball.

Semiconductor device manufacturing method and semiconductor device

This invention enhances reliability of an electrical test. A semiconductor device manufacturing method in which a potential (first potential) is supplied by bringing a plurality of first and second test terminals into contact with a plurality of leads, respectively in the step of supplying the potential to the leads (first leads) to carry out the electrical test. The first test terminals come into contact with the leads, individually, and the second test terminals come into contact with the leads in one batch.

Semiconductor device manufacturing method

Improvement in yield of a semiconductor device is obtained. In addition, increase in service life of a socket terminal is obtained. A projecting portion PJand a projecting portion PJare provided in an end portion PU of a socket terminal STE. Thus, it is possible to enable contact between a lead and the socket terminal STE in which a large current is caused to flow, at two points by a contact using the projecting portion PJand by a contact using the projecting portion PJ, for example. As a result, the current flowing from the socket terminal STEto the lead flows by being dispersed into a path flowing in the projecting portion PJand a path flowing in the projecting portion PJ. Accordingly, it is possible to suppress increase of temperature of a contact portion between the socket terminal STEand the lead even in a case where the large current is caused to flow between the socket terminal STEand the lead.

Method of manufacturing a semiconductor device and inspecting an electrical characteristic thereof using test socket terminals

Method of manufacturing a semiconductor device and inspecting an electrical characteristic thereof using socket terminals

The reliability of multipoint contact by a contact pin with an external terminal is improved while achieving an improvement in easiness of manufacture of the contact pin. The contact pin includes first and second contact pins. Further, the first contact pin has a support portion extending in a y direction and a tip portion connected to the support portion. The second contact pin also has a support portion extending in the y direction and a tip portion connected to the support portion. Here, the support portion of the first contact pin and the support portion of the second contact pin are arranged side by side along an x direction in a horizontal plane (xy plane). Further, the tip portion of the second contact pin is shifted from the tip portion of the first contact pin along the y direction in the horizontal plane, crossing (perpendicular to) the x direction.

Growing community of inventors

Gunma, Japan

Toshitsugu Ishii