Sekisui Chemical Co., Ltd.

Adeka Corporation

Toshitaka Yoshitake

Yousuke Okada

Takehiko Ushimi

Masaki Tono

Hideaki Yano

Taichi Makida

Kenji Otsuka

Kazuhiro Okada

Yasunari Kusaka

Tetsuo Kamimoto

Mitsuru Fukushima

Toshio Nakajima

A flame-retardant urethane resin composition comprises a polyisocyanate compound, a polyol compound, a trimerization catalyst, a foaming agent, a foam stabilizer, and an additive, in which the trimerization catalyst is at least one selected from the group consisting of a nitrogen-containing aromatic compound, a carboxylic acid alkali metal salt, a tertiary ammonium salt, and a quaternary ammonium salt, and the additive comprises red phosphorus and at least one selected from the group consisting of a phosphoric acid ester, a phosphate-containing flame retardant, a bromine-containing flame retardant, a boron-containing flame retardant, an antimony-containing flame retardant, and a metal hydroxide.

Flame-retardant urethane resin composition

The flame-retardant urethane resin composition contains a polyisocyanate compound, a polyol compound, a trimerization catalyst, a blowing agent, and an additive, wherein the additives include red phosphorus and a filler, and the filler has an aspect ratio of 5 to 50, an average particle diameter of 0.1 &#x3bc;m or larger, but smaller than 15 &#x3bc;m, and a melting point of 750&#xb0; C. or higher.

A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy resin contains a bisphenol-type epoxy compound and an aliphatic epoxy compound, wherein the weight ratio of the bisphenol-type epoxy compound to the aliphatic epoxy compound is in the range 95:5-60:40.

Thermal expansion resin composition

A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy compound contained in said epoxy resin contains a brominated epoxy compound, and contains, in addition to the brominated epoxy compound, a bisphenol-type epoxy compound and/or an aliphatic epoxy compound, wherein the weight ratio of the brominated epoxy compound to the bisphenol-type epoxy compound and/or aliphatic epoxy compound is in the range 99:1-1:99.

Thermally expandable resin composition

A synthetic resin composition containing, 100 parts by mass of a synthetic resin, 0.001-10 parts by mass of a triazine compound represented by (1) below, and 0.001-10 parts by mass of a diarylpentaerythritol diphosphite compound represented by general formula (2) shown below and/or 0.001-10 parts by mass of an organic cyclic phosphite compound represented by formula (3) below and/or 0.001-10 parts by mass of a hindered phenol compound represented by formula (4) below.  In formula (1), Ris C1-C12 alkyl group, etc.; Ris C1-C8 alkyl group, etc.; Ris hydroxyl group, etc.; and Ris &#x2014;O&#x2014;R, etc. In formula (2), Ris C1-C4 alkyl group, etc. In formula (3), Rand Ris each C1-C4 alkyl group, etc, and Ris C1-C18 alkyl group. In formula (4), Ris a residue remaining after removing n hydroxyl groups from a mono- to tetravalent alcohol, and n is an integer 1-4.

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Saitama, Japan

Toshitaka Yoshitake