Toagosei Chemical Industry, Co., Ltd.

Meiko Electronics Co., Ltd.

Toagosei Chemical Industry

Toshiro Miki

Tatsuo Wada

Hiroyuki Kato

Tsutomu Ito

Shiro Kojima

Kishiro Azuma

Yuichi Murakami

Hiroshi Niizuma

Norio Kawachi

Masamitsu Takenaka

Katsurou Aoshima

Takeharu Kato

A process for producing a copper-clad laminate is disclosed which includes the steps of (a) contacting the surface of a conductive carrier with a catalyst liquid containing at least one noble metal selected from the group consisting of Pd, Pt, Ru, Au, and Ag; (b) subsequently forming a copper foil layer on the treated surface of the conductive carrier by copper electroplating; (c) laminating an insulating base on the copper foil layer by hot-press bonding; and (d) separating the conductive carrier from the resulting laminate. The copper foil layer in the resulting copper-clad laminate has reduced pinholes and exhibits isotropic mechanical characteristics.

Process for producing copper-clad laminate

A method suited for producing a conductor circuit board having a high-density, fine circuit pattern. Conductor circuits and dummy circuits are formed on the surface of a planar, electrically conductive substrate, and after removing a resist mask, unnecessary dummy circuits are removed. A thin metal film is formed over the surface of the conductive substrate and the surfaces of the conductor circuits and remaining dummy circuits. An insulating substrate is superposed on the surface of the conductive substrate on which the thin metal film is formed, and the two substrates are pressure-bonded together with heat applied thereto. Subsequently, only the conductive substrate is removed, and exposed portions of the thin metal film are removed by etching. In the case of producing a conductor circuit board with a through hole, a through hole is formed after the step of separating the conductive substrate, and then through-hole plating is carried out, followed by the removal of exposed portions of the thin metal film by etching.

Method of producing conductor circuit boards

A process for producing acrylic acid or methacrylic acid by reacting acetic acid or propionic acid with formaldehyde in a gas phase is described, characterized by carrying out the reaction in the presence of a solid catalyst containing at least one of boron oxide or phosphorus oxide and having an acid site of an acid strength, pKa.ltoreq.-3.0. The solid catalyst is of high activity and is satisfactory in both selectivity and conversion and, furthermore, its high selectivity can be maintained for long periods of time. Thus the desired product, acrylic acid or methacrylic acid, can be produced in high yield.

Process for the production of acrylic acid or methacrylic acid

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Tokyo, Japan

Toshiro Miki