Hosiden Corporation

Toshiro Izuchi

Kensuke Nakanishi

Kazuo Ono

Hiroaki Onishi

Ryuji Awamura

Tsuyoshi Baba

Hiroshi Yamagata

Naosuke Fukada

Kiyoshi Ota

Hideki Kozawa

An electret condenser microphone is provided that can reduce parasitic capacitance and realize enhanced sensitivity. The electret condenser microphone includes a capacitor section including a fixed electrode having an electret member and a diaphragm electrode, a casing section housing the capacitor section, a circuit board including a converter circuitfor converting variations of capacitance of the capacitor section caused by vibrations of the diaphragm electrode to electric signals for output, and conducting elements for making the capacitor conductive with the circuit board, in which the casing section has a shape as viewed from top different from a shape of the capacitor as viewed from top to provide different distances between outer sides of the capacitor section and the casing section circumferentially of the capacitor section as viewed from top.

Electret condenser microphone

An electret condenser microphone comprising a metal capsule having a top surface provided with sound receiving holes, a diaphragm, a back electrode plate that faces either one of surfaces of the diaphragm and that is provided separately from the capsule, and an electret layer formed on the back electrode plate or the diaphragm. The diaphragm, the back electrode plate and the electret layer are all mounted inside the capsule. The top surface includes a suctioned portion in its center on which suction force can be applied by a suction-type transporting device, and the sound holes are formed circumferentially around the suctioned portion.

Electret condensor microphone

A microphone contains a capacitor in a capsule with a diaphragm serving as one of electrodes of the capacitor. The microphone is mounted on a mounting board when external terminals installed on an external surface of a circuit board which closes an opening of the capsule are connected face to face with connection terminals on the mounting board. A sound hole is formed in the circuit board and through-hole is formed in the mounting board, being placed in such a position as to avoid overlapping each other when the microphone is mounted. An enclosed space which communicates the through-hole and sound hole is formed when the external terminals are connected with the connection terminals on the mounting board.

Microphone and microphone mounting structure

In order to automate a microphone assembly process including a dust-proof treatment, an object of the present invention is to provide a dust-proof microphone having a configuration suitable for automated assembly. According to the present invention, a microphone has a plate-like or film-like dust-proof section that is disposed in a conductive housing (capsule) having a sound aperture and covers the sound aperture. The dust-proof section has a plurality of pores at least in a region corresponding to the sound aperture, and the dust-proof section further has a nonporous region. In the case of an electret condenser microphone, from the viewpoint of performance of the microphone, the dust-proof section is conductive. In addition, taking into account a soldering in a reflow furnace, the dust-proof section is heat-resistant. Each pore is desirably designed taking into account the environment for the usage of the microphone. However, if it is supposed that the microphone is used near one's mouth, each pore has an area of 0.01 mmor less. In addition, to enhance the dust-proof effect, the pores may be subjected to a water-repellent treatment.

Microphone with dust-proof section

An object of the present invention is to provide an electro-acoustic transducer having the effects of absorbing vibration and high-frequency noise, reducing the number of components, and preventing heat conduction at the same time. An electro-acoustic transducer according to the present invention includes: an electrically conductive capsule having an opening for electrically connecting internal circuitry to an external object; terminals which protrude from the opening to the outside; and a raised part which is a portion of the capsule on the opening side and is spaced with a gap from the internal structure of the capsule. The raised part and the terminals are arranged in such a manner that the raised part and all of the terminals are able to be directly soldered to a wiring board. The raised part may extend toward the terminals in such a manner that the opening is narrowed. Furthermore, the raised part may have a slit extending to the boundary between the raised part and the other part of the capsule.

Electro-acoustic transducer

To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate. A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape.

Mounting substrate and microphone mounted thereon

An electro-acoustic transducer, for example a microphone, with a holder is provided with a block-shaped holder having on the front face a housing chamber housing a microphone main body with its acoustic holes situated on the external face, the microphone main body housed in the housing chamber, a plurality of connection electrodes connected to a plurality of terminal electrodes formed on the microphone main body, respectively, and a plurality of mounting electrodes exposed at each of a front face, a back face and a rear end face in correspondence with the plurality of connection electrodes.

Electro-acoustic transducer with holder

Affixed in intimate contact to the inside surface of a front boardof a conductive capsuleprovided with a receiving sound apertureis a conductive back electrode board provided with air vent apertureswhich are positioned not in alignment with the receiving sound aperture, these aperturesandbeing connected by a slitA polarized FEP filmwhich is an electret film is disposed on the surface of the back electrode boardopposite from the front board 10, and a conductive diaphragmis disposed on the surface of the FEPopposite from the back electrode boardwith a spacerinterposed therebetween which extends around the outer periphery of the opposite surface of the FEPThese component parts are accommodate in the capsuleto constitute an electret condenser microphone which is capable of suppressing sensitivity degradation due to ingress of grit from the outside to the electret film.

Growing community of inventors

Fukuoka, Japan

Toshiro Izuchi