Hitachi, Ltd.

The University of Tokyo

Renesas Technology Corp.

Hitachi Device Engineering Co., Ltd.

Semiconductor Technology Academic Research Center

Toshiro Hiramoto

Nobuo Tamba

Masanori Odaka

Masayuki Ohayashi

Takayasu Sakurai

Takayuki Uda

Kazuhiro Akimoto

Kayoko Saito

Tasuku Tanaka

Hisashi Ishida

Jun Hirokawa

Motoki Kasai

Kazuo Tanaka

Makoto Suzuki

Goro Kitsukawa

Makoto Takamiya

Atsuo Watanabe

Takahide Ikeda

Hiroaki Nambu

Kazuo Kanetani

Hisayuki Higuchi

Noriyuki Homma

Satoru Isomura

Youji Idei

Kunihiko Yamaguchi

Toshiyuki Kikuchi

Masami Usami

Yoshiaki Sakurai

Toru Koizumi

Kenichi Ohata

Takashi Inukai

The voltage Vdd is set to be lower than in the normal operation (step S), then voltage is applied to each of the power-supply voltage applied node Vdd, the ground voltage applied node Vss, the semiconductor substrate and the well so that relative high voltage between the gate of turn-on transistor and the semiconductor substrate or the gate of turn-on transistor and well (steps Sand S). This process accomplishes rising of the threshold voltage of the transistor that is turned on, the reduction of the variation in the threshold voltage between a plurality of the transistors of the memory cell including latch circuit, and the improvement of the voltage characteristic of the memory cell.

Voltage characteristic regulating method of latch circuit, voltage characteristic regulating method of semiconductor device, and voltage characteristic regulator of latch circuit

A MOS transistor with a controlled threshold voltage includes a SOI which includes a substrate composed of a semi-conducting material, a single crystal layer composed of a semi-conducting material and an insulating layer interposed between the substrate and the single crystal layer. The single crystal layer is formed therein with a source region, a drain region and a surrounded region surrounded by the source region and the drain region. The surrounded region includes a depletion layer having a composition surface which is in contact with the insulating layer. The MOS transistor comprises an EIB-MOS transistor of which the substrate is adapted to be applied with a voltage of a first polarity for inducing charges of a second polarity over the composition surface of the surrounded region.

MOS transistor with a controlled threshold voltage

A semiconductor memory device having a plurality of memory cells each comprising two CMOS inverters cross-coupled to each other and arranged at intersections between a plurality of word lines extending in a column direction and a plurality of complementary data line pairs extending in a row direction; wherein p-channel type load MISFETs of the memory cells arranged in the column direction are formed on the main surface of an n-type well region in the direction in which the word lines extend, the source regions of the p-channel type load MISFETs of the memory cells arranged in the column direction are electrically connected to the n-type well region through conductor layers, and each of the conductor layer is formed independently of the memory cells arranged in the column direction. More specifically, the n-type well regions are fed with a first fixed potential, and the source region of each of the p-channel type load MISFETs is fed with the first fixed potential through the conductor layers which are formed independently.

Semiconductor memory device

A semiconductor integrated circuit of the present invention has a CMOS circuit composed of a first MOSFET and a switch composed of a second MOSFET which are connected in series. Then, a circuit-driving voltage and a switch-driving voltage are applied independently to the CMOS circuit and the switch The switch-driving voltage is larger than the circuit-driving voltage.

Semiconductor integrated circuit

A semiconductor integrated circuit device includes an element separating first and second grooves formed to surround active regions to be formed with a semiconductor element. In addition a third groove is formed to surround at least a portion of the first groove, when viewed from a plane view. In the semiconductor integrated circuit device, the active regions and an element separating region of a silicon layer are insulated from each other by the separating grooves extending from the main surface of the silicon layer to an underlying insulating layer, and are fed with a common fixed potential.

Semiconductor integrated circuit device including an improved separating

Disclosed are a semiconductor integrated circuit device and methods for production thereof. An embodiment of the invention is a semiconductor chip that comprises fuses constituting part of redundancy circuits formed therein, the fuses being made of the same ingredients CCB bump substrate metal. The fuses are patterned simultaneously during the patterning of the CCB bump substrate metal. This involves forming the fuses using at least part of the ingredients of an electrode conductor pattern in the chip. The cutting regions of the fuses are made of only one of the metal layers constituting the substrate. The principal plane of the semiconductor chip has a fuse protective film formed over at least the cutting regions of the fuses for protection of the latter. In operation, a switch MOSFET under switching control of a redundancy signal is used to select one of two transmission paths, one carrying an address signal or a decode signal, the other carrying a reference voltage. This allows a faulty circuit to be replaced with the corresponding redundancy circuit.

Semiconductor integrated circuit device and methods for production

A semiconductor integrated circuit device is provided for permitting operation of a CMOS or BiCMOS memory with ECL level input signals, in which operating speed is increased and power consumption is reduced. Input signals of ECL levels are received by an input buffer for amplifying the input signals to an output signal level within a range where differential transistors of the input buffer operate in an unsaturation region. The output signal of the input buffer is supplied to a CMOS circuit or Bi-CMOS circuit which is operated by both an operating voltage having a first-stage smaller absolute value than that of the operating voltage of the input buffer and the ground potential of the circuit. This first stage CMOS or BiCMOS circuit also includes an arrangement to further amplify the received signals to provide further level conversion. Since both the input buffer and the first-stage CMOS or Bi-CMOS circuit perform signal transmission and level conversions, high-speed operation and low power consumption can be achieved by a simple structure.

Semiconductor integrated circuit device including input circuitry to

Disclosed are a semiconductor integrated circuit device and methods for production thereof. An embodiment of the invention is a semiconductor chip that comprises fuses constituting part of redundancy circuits formed therein, the fuses being made of the same ingredients as those of a CCB bump substrate metal. The fuses are patterned simultaneously during the patterning of the CCB bump substrate metal. This involves forming the fuses using at least part of the ingredients of an electrode conductor pattern in the chip. The cutting regions of the fuses are made of only one of the metal layers constituting the substrate. The principal plane of the semiconductor chip has a fuse protective film formed over at least the cutting regions of the fuses for protection of the latter. In operation, a switch MOSFET under switching control of a redundancy signal is used to select one of two transmission paths, one carrying an address signal or a decode signal, the other carrying a reference voltage. This allows a faulty circuit to be replaced with the corresponding redundancy circuit.

A semiconductor integrated circuit device including a level conversion circuit in which the simplifying of the circuit and the increasing of the speed of operation have been attained is provided. A pair of complementary output signals amplified to a required signal level by a current switch circuit including differential transistors which receive an input signal and a reference voltage are inputted into a pair of emitter follower circuits. An emitter follower output transistor is driven by an output signal from one emitter follower circuit, while an N-channel MOSFET provided between the output transistor and a current source used as a load is driven by an output signal from the other emitter follower circuit, to obtain a level-amplified output signal from an emitter of the output transistor. The speed of an operation of the circuit device can be increased to a high level owing to a simple circuit in which a level, which is required to attain an output amplitude, of complementary output signals is secured by the current switch circuit, the amplified complementary signals being inputted into the emitter follower circuit to directly drive the output transistor.

Semiconductor integrated circuit device and memory consisting of

Growing community of inventors

Yokohama, Japan

Toshiro Hiramoto