Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Toshio Yamazaki

Takashi Uchida

Yusuke Nakamura

Hideki Ueda

Tomohiro Mitani

Koichiro Nakashima

Takeshi Mori

Hiroyuki Fujii

Isao Hattori

Hirotsugu Suzuki

Chikara Nara

Naruhito Noda

Toshitsugu Konishi

A sensor system includes a sensor element, a signal processing circuit, and a pseudo-signal correction circuit. The sensor element outputs an electric signal corresponding to an external force. The signal processing circuit converts the electric signal coming from the sensor element into a signal having a certain signal format and then outputs the signal thus converted. The pseudo-signal correction circuit corrects a pseudo-signal outputted by the sensor element. When receiving a test signal, the sensor element performs a self-diagnosis based on the test signal and then outputs the pseudo-signal, which represents a result of the self-diagnosis. The pseudo-signal correction circuit corrects the pseudo-signal based on environment information about an environment where at least one of the sensor element or the signal processing circuit is located.

Sensor system, sensing method, and program

A sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically connected to the supporting member. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the supporting member together. The substrate and an installation member on which the sensor element is installed intersect with each other. The sensor element and the supporting member are separated from each other.

Sensor device and sensor

A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.

Sensor device

A placing member is configured to be supported from an outside by a terminal electrically connected to a terminal electrode, and an X-axis-direction extended portion, a Y-axis-direction extended portion, and a Z-axis-direction extended portion are provided in the terminal. This configuration provides an angular velocity sensor, in which a problem such that Y-axis-direction and Z-axis-direction vibrations applied from the outside cannot be damped is eliminated, and all the vibrations in three axis directions can be damped.

Angular velocity sensor

Angular speed sensor for detecting angular speed

An angular velocity of the present invention includes a resonator formed of a resonating member and a connecting member, a first base connected to the connecting member, a holding plate to hold the first base, a circuit board fixed onto the holding plate, an elastic body disposed on an end part of at least one selected from the holding plate and circuit board, a case housing the resonator, first base, holding plate, circuit board and elastic body and provided with an opening, and a second base put in place so as to close the opening of the case. The resonator has a short side and a long side. The resonator is located with the direction of the long side thereof arranged perpendicular to the second base, the elastic body is located between an end part of at least one selected from the holding plate and circuit board and the walls of the case, and at least one selected from the holding plate and circuit board is held by the case with an elastic pressure of the elastic body, thereby allowing the compression rate of the elastic body to be prevented from varying. As a result, an angular velocity sensor having stable output characteristics is realized.

Angular sensor and method of manufacture thereof

Growing community of inventors

Fukui, Japan

Toshio Yamazaki