Mitsubishi Denki Kabushiki Kaisha

Toshio Yada

Michinari Tsutsumi

Atsushi Endo

Masaru Aoki

Taro Maejima

Takeshi Terazono

Tsuyoshi Tabuchi

A method for etching a chromium film includes the steps of forming a resist having a phenol novolak resin as a principal chain on the chromium film formed on a substrate, and etching the chromium film using an etchant while stripping off the resist from the chromium film using an etchant containing nitric acid. A second method for etching a chromium film includes the steps of forming an aluminum film or an aluminum alloy film on the chromium film formed on a substrate, forming a resist having a predetermined pattern on the aluminum film or the aluminum alloy film, etching the aluminum film or the aluminum alloy film and the chromium film using phosphoric acid, and removing by etching the aluminum film or the aluminum alloy film using phosphoric acid containing nitric acid after removing the resist.

Method for etching chromium film formed on substrate

A method for etching a chromium film includes the steps of forming a resist having a phenol novolak resin as a principal chain on the chromium film formed on a substrate, and etching the chromium film using an etchant while stripping off the resist from the chromium film using an etchant containing nitric acid. A second method for etching a chromium film comprises the steps of forming an aluminum film or an aluminum alloy film on the chromium film formed on a substrate, forming a resist having a predetermined pattern on the aluminum film or the aluminum alloy film, etching the aluminum film or the aluminum alloy film and the chromium film using phosphoric acid, and removing by etching the aluminum film or the aluminum alloy film using phosphoric acid containing nitric acid after removing the resist.

An apparatus for coating the flat surface of a substrate with a coating material is disclosed in which only a minimum amount of coating material is required for uniformly coating the entire surface of the substrate in an efficient manner under a variety of coating conditions, even if the substrate surface takes a non-circular configuration. According to one embodiment, the flat surface of the substrate is first coated with a coating material, and the substrate thus coated is then spunned at predetermined number of revolutions per minute. According to another embodiment, the apparatus includes a support table on which the substrate is fixedly mounted. A plurality of shaping members are slidably mounted on the support table for forming with the flat non-circular-shaped surface of the substrate a flat continuously extending circular-shaped surface. A plurality of biasing members are provided one for each shaping member for biasing the shaping members radially inwards into intimate contact at their inner sides with the peripheral side surfaces of the substrate mounted on the support table. A plurality of level adjusting mechanisms are provided on the shaping members for adjusting the surface of the shaping members to be flush with the flat surface of the substrate.

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Hyogo, Japan

Toshio Yada