Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Toshio Tsuda

Seiichi Nakatani

Toshiyuki Fukuda

Yoshihiro Bessho

Takeshi Kawabata

Kazuhiro Nobori

Toru Ishida

Yasuhiko Horio

Motoaki Satou

A semiconductor module is formed by alternately stacking resin boards and sheet members. Each of the resin boards includes first buried conductors. A semiconductor chip is mounted on the upper face of each of the resin boards. Each of the sheet members having an opening for accommodating the semiconductor chip and including second buried conductors electrically connected to the first buried conductors. A first resin board located at the bottom is thicker than second resin boards. Each of the sheet members includes an adhesive member covering the upper and side faces of the semiconductor chip.

Multilevel semiconductor module and method for fabricating the same

A semiconductor module is formed by alternately stacking resin boardson which semiconductor chipsare mounted and sheet members having openings larger than the semiconductor chipsand bonded to the resin boards. The resin boardlocated at the bottom out of the resin boardsis thicker than the other resin boards

Multi-level semiconductor module and method for fabricating the same

A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conducting adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.

Method of forming an electrical contact bump

A substrate provided with conductive terminals and another substrate provided with electrode pads and two-stepped electrical contact bumps formed respectively on the electrode pads and each consisting of a first raised portion and a second raised portion formed on the first raised portion, are joined securely by bonding the second raised portions coated respectively with droplets of conductive adhesive and the corresponding conductive terminals by the droplets of the conductive adhesive. The ratio of the area of a section of the first raised portion in a plane parallel to the surface of the electrode pad is greater than the area of a section of the second raised portion parallel to the section of the first raised portion at a predetermined ratio. In an exemplary method of forming the electrical contact bump, the second raised portion is formed by bending a conductive wire in a loop by a ball bonding apparatus.

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Osaka, Japan

Toshio Tsuda