Sony Corporation

Toshio Toyama

Noboru Sekiguchi

Kazuhiro Abe

Minoru Shimada

Harutaka Hayasaka

Hitoshi Terada

Akihiro Koga

Katsumi Morita

Tadamasa Tanaka

Tetsuya Yonemoto

Kazuya Kato

Kenji Ishihara

Hisashi Naoshima

Yusuke Masutani

Syunji Aoki

Toru Arai

Katsumi Togasaki

Masashi Yajima

Mitsuo Inoue

Fumio Matsumoto

Kazuhisa Mochida

Hiroji Kameda

Takanori Arai

An electronics packaging system () including a printer (), a placing unit () and a reflow unit (), wherein a printed wiring board () is carried while being kept in an upright position. The printed wiring board () has solder printed on all the lands thereof at the same time, the electronic parts () are all placed on the lands at the same time, and the electronic parts () are all soldered to the lands at the same time. Thus, the system () can be designed more compact, and the electronic parts packaged in a shorter time.

System for mounting electronic device

A reflow soldering apparatus for soldering parts which are temporarily fixed on a substrate by using cream solder. The apparatus includes a hot gas blower provided with a number of holes for blowing hot gas through the holes. The apparatus also includes a substrate moving mechanism for moving the substrate along the hot gas blower at a distance therefrom to expose the substrate to hot gas blown through the holes, thereby reflowing the cream solder.

Reflow soldering apparatus

Growing community of inventors

Saitama, Japan

Toshio Toyama