Mitsumi Electric Company Ltd.

Mitsubishi Denki Kabushiki Kaisha

Other

Renesas Electronics Corporation

Ryoden Semiconductor System Engineering Corporation

Toshio Takeuchi

Shunichi Abe

Naoto Ueda

Masanori Matsunaga

Yoshirou Nishinaka

Yoshihiro Sakanushi

Shuichi Osaka

Ichiro Hayashi

Tadao Kazuno

Katsuyuki Fukutome

Koji Yamashita

Akio Yamada

Yoshihiro Tomita

Yoshihiro Kashiba

Hirotoshi Hayasawa

Kiyoaki Tsumura

Hiroshi Miyakawa

Hideyuki Ichiyama

Tsutomu Kudo

Kenji Ohgiyama

Sadahiro Ohyama

Goro Izuta

Jiro Nakano

Noriaki Sekine

Hideji Matsuura

Noribumi Ishi

Susumu Ishida

Kenji Kan

Mitsugu Hirata

Shuzo Ishida

Waichi Ishizuka

Masatoshi Watanabe

Seizou Ohumae

Naomichi Okuma

Katunori Asai

Masaaki Namatame

A status holding circuit includes status holding sections of M stages (M is an integer equal to or more than 2) connected in series. Each of the status holding sections includes: N latches (N is an integer equal to or more than 2) provided for N input signals to N input terminals, respectively; and a switch circuit configured to set a data to a jlatch of the N latches in an istatus holding section of the M-stage status holding sections when a status signal is supplied to a jinput terminal of the N input terminals at an itiming.

Status holding circuit and status holding method

A semiconductor laser element and a protective wall surrounding the element are provided on the surface of a metal frame of a semiconductor laser device. Circumferential portions are provided on an outer periphery of the metal frame for rotating the optical axis of light originating from a light-emitting point of the semiconductor laser element to a direction along the surface of the metal frame. By way of a guide of an optical pickup base corresponding to the circumferential portions, the semiconductor laser device is mounted on the optical pickup base.

Semiconductor laser device, and optical pickup apparatus using the device

In a method of preparing an audio disc by writing music in an additionally recordable optical disc, a specific TOC is first written in a lead in area (LIA) of the additionally recordable optical disc. Thereafter, the music to be recorded is written in a program area of the additionally recordable optical disc.

Preparing method for audio disc wherein a specific TOC is first written in a LIA

Fine granular feeds for fry of fishes and shellfishes capable of remarkably elevating the survival rate of fry, improving the cultivation efficiency, and causing little elution of nitrogen sources therefrom into seawater or water in feeding, which are characterized by containing at least three active components, i.e., (a) a long-chain unsaturated fatty acid calcium salt blend comprising 80% by weight or more of long-chain unsaturated fatty acid calcium salt(s) having at least 18 carbon atoms, (b) 20% by weight or less of a browned matter formed by heating molasses or saccharides, a browned matter formed by heating saccharides with amino acids or a mixture thereof at an arbitrary ratio, and (c) a mixture of peptides obtained by hydrolyzing animal protein, and being in the form of fine grains.

Fine granular feeds for fry

An optical disk writing device includes an optical disk drive recording data into an optical disk and having no harddisk as a data buffer, and a host; computer controlling the optical disk drive and transferring the data to the optical disk drive by using a data storage connected to the host computer as a data buffer for the transferring and the recording.

Optical disk recording device and optical disk drive

An optical disk writing device includes an optical disk drive recording data into an optical disk and having no harddisk as a data buffer, and a host computer controlling the optical disk drive and transferring the data to the optical disk drive by using a data storage connected to the host computer as a data buffer for the transferring and the recording.

In a first step of an optical disk write method, an area for logical format information is reserved on an optical disk; in a second step, variable-length packets, each packet comprising a demarcation block and a variable-length data block including a new file or a corrected file, on a data area, in response to a write instruction for writing the new file or the corrected file; in a third step, a volume history indicating a logical structure of files is maintained and file logical information for written and deleted files is chronologically appended to the volume history; in a fourth step, logical format information of the optical disk is produced based on the volume history, in response to an instruction for finalization; and in a fifth step, the logical format information, a lead-in area and a lead-out area are provided on the optical disk.

Optical disk write method

A solder material comprises a first solder plate and a second solder plate having a thickness equal to or larger than 1 micron provided at the both surfaces of the first solder plate comprising material-having a lower melting point than the first solder or material which reacts with the first solder to produce an alloy having a lower melting point than the first solder. A junctioning method comprise putting the above-described solder material inserted between two objects to be junctioned to each other; heating the solder material to a temperature higher than the melting point of the second solder or the alloy and lower than the melting point of said first solder thereby to melt the second solder or the alloy; and thereafter cooling or keeping the solder material at a temperature in the vicinity of the melting point thereby to junction the objects to be junctioned to each other. The second solder plate has preferably a thickness less than 5 microns and the first solder plate has preferably a thickness equal to or larger than 30 microns. By this construction, the interval between the objects to be junctioned can be controlled to a predetermined thickness and the stress functioning to the objects can be relaxed as well as there arises no positional deviation between the objects.

Solder material, junctioning method, junction material, and

A solder material comprises a first solder plate and a second solder plate having a thickness equal to or larger than 1 micron provided at the both surfaces of the first solder plate comprising material having a lower melting point than the first solder or material which reacts with the first solder to produce an alloy having a lower melting point than the first solder. A junctioning method comprises putting the above-described solder material inserted between two objects to be junctioned to each other; heating the solder material to a temperature higher than the melting point of the second solder or the alloy and lower than the melting point of said first solder thereby to melt the second solder or the alloy; and thereafter cooling or keeping the solder material at a temperature in the vicinity of the melting point thereby to junction the objects to be junctioned to each other. The second solder plate has preferably a thickness less than 5 microns and the first solder plate has preferably a thickness equal to or larger than 30 microns. By this construction, the interval between the objects to be junctioned can be controlled to a predetermined thickness and the stress functioning to the objects can be relaxed as well as there arises no positional deviation between the objects.

A method of and an apparatus for producing semiconductor devices, in which a semiconductor wafer is adhered to an ultraviolet tape the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet tape being adhered to a frame ring so that the semiconductor wafer is fixed to the frame ring through the ultraviolet tape. Successive semiconductor wafers thus fixed to respective frame rings are subjected to a series of steps including dicing, breaking and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided into dices and held by the ultraviolet tape with reduced adhesiveness is sent to a next step such as die-bonding step.

Apparatus for producing semiconductor device

A method and an apparatus for producing semiconductor devices in which a semiconductor wafer is adhered to an ultraviolet sensitive tape, the adhesion force of which decreases upon irradiation with ultraviolet rays, the ultraviolet sensitive tape being adhered to a ring frame so that the semiconductor wafer is fixed to the ring frame with the ultraviolet sensitive tape. Successive semiconductor wafers thus fixed to respective ring frames are subjected to a series of steps including dicing, breaking, and ultraviolet irradiation for reducing the adhesiveness of the ultraviolet tape. The semiconductor wafer, broken and divided in dice and held by the ultraviolet sensitive tape with reduced adhesiveness, is sent to a next step, such as a die-bonding step.

Method of dividing semiconductor wafer using ultraviolet sensitive tape

An optical transmitting and/or receiving module comprises an optical plug comprising a housing which is provided with at least one ferrule assembly having an optical fiber therein, a main receptacle body connected to the optical plug, and an optical link assembly comprising a substrate. The substrate has at least one optical semiconductor element and circuit elements for signal processing fixed thereon. The optical link assembly is fixed to the main receptacle body so that the at least one optical semiconductor element opposes a tip end of the optical fiber of the optical plug and a surface of the substrate is perpendicular to an optical axis of the optical fiber.

Optical transmitting and/or receiving module

A rotary foot-operated massaging device having a crank shaft, a pair of pedal axles connected to the opposite ends of the crank shaft, a pedal rotatably carried by each pedal axle and a massaging member carried at least on each pedal axle. The device may either be an independent floor-mounted unit or form a part of a bicycle to also serve as a propelling unit therefor.

Rotary foot-operated massaging device

Growing community of inventors

Kanagawa, Japan

Toshio Takeuchi