Fujitsu Corporation

Nihon Den-netsu Keiki Co., Ltd.

Toshio Takeda

Junichi Yamazaki

Yogo Kaneko

Youichi Ehara

Shinya Echigo

A processing method includes: collecting processing information indicating a processing state of an application executed by an information processing device and operational information indicating operational states of processing elements that are identified on the basis of configuration information stored in a storage unit and are involved in the execution of the application; determining whether or not there is a correlation between the processing state and an operational state of each of the processing elements on the basis of the processing information and the operational information when a delay of a process of the application is detected on the basis of the processing information; and extracting, from among the processing elements, a processing element of which an operational state has a correlation with the processing state on the basis of the determination.

Processing method, processing apparatus, and recording medium to determine operational state of processing element

A soldering device includes a solder vessel for containing a molten solder, solder ejecting nozzle disposed in the solder vessel for upwardly ejecting the molten solder to form a solder wave thereabove, a cover plate covering the vessel and having an opening such that the solder wave can pass therethrough, a nozzle forming body provided adjacent at least one side of the solder wave to define a thin space between the nozzle forming body and the cover plate, and a gas feed conduit connected to the nozzle forming body for feeding a gas to the thin space, so that the gas is jetted through the thin space and flows toward the solder wave.

Growing community of inventors

Machida, Japan

Toshio Takeda