Hitachi, Ltd.

Toshio Takasaki

Heikichi Kuwahara

Eiichi Toyota

Kazumasa Fujioka

Syuuji Saitoo

A cooling apparatus for electronic device comprises an electronic element unit which comprises a base member, a thermal conductive electric insulating layer soldered to the base member and a plurality of electronic elements soldered to the thermal conductive electric insulating layer at least one cooling unit which is detachably kept in pressure contact with the base member of the electronic element unit and comprises a cooling block, at least one heat pipe having a refrigerant sealingly contained therein and inserted in the cooling block at one end thereof and a plurality of radiation fins provided at the other end of the at least one heat pipe; and a device which serves to detachably keep the electronic element unit and the cooling unit in pressure contact with each other. The other end of the heat pipe extends obliquely with a predetermined angle (.alpha.) with respect to the inserted portion thereof.

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Katsuta, Japan

Toshio Takasaki