Sumitomo Electric Industries, Limited

Amada Company, Limited

Sumitomo Electric Device Innovations, Inc.

Toshio Takagi

Takashi Kato

Hiroyuki Yabe

Jiro Shinkai

Yasushi Fujimura

Koichi Tsuchida

Hisao Go

Wataru Matsunaga

Kazuyoshi Mihara

Hiromi Kurashima

Tomomi Sano

Michio Suzuki

Kenichiro Ohtsuka

Toshifumi Hosoya

Atsushi Miki

Kuniyuki Ishii

Goro Sasaki

Toshiaki Kihara

Kiyoshi Kato

Masanobu Kawamura

Noriyuki Hirakata

Fumihiro Nakajima

Kazunori Tanaka

Yoko Watanabe

Masanobu Ishii

Kazuaki Mii

Kazuhiro Tanida

Yukio Fukui

Nobuyuki Shimizu

Yoshiyuki Matsui

Norimasa Kushida

Keitaro Koguchi

Tamaki Wakasaki

Akihiko Sanguu

Ryuharu Emori

An optical module is disclosed where an optical coupling efficiency between an optical device and an external fiber may be improved. The optical module includes an optical receptacle and a device unit assembled with the optical receptacle only via a stub as forming a gap to isolate these two components. The gap is filled with insulating resin or tightly covered by an insulating ring to reinforce the stub to be hard for an increased moment by the optical assemblies in the device unit.

Optical module with device unit electrically isolated from optical receptacle

An optical transceiver is disclosed, where the optical transceiver includes an optical subassembly (OSA) with a bottom plate for dissipating heat and connected to an electronic circuit with a flexible printed circuit (FPC). The FPC is soldered with the side electrodes of the OSA as forming a solder fillet in the plane electrode, or the FPC is soldered with the plane electrodes of the OSA as forming the solder fillet in the side electrodes, and leaving a limited room for receiving the curved FPC in peripheries of the OSA.

Optical transceiver implementing with flexible printed circuit connecting optical subassembly to circuit board

A method to manufacture an optical module is disclosed, wherein the optical module has an optically active device on a lead frame and a lens co-molded with the active device and the lead frame by a transparent resin as positioning the lens with respect to the lead frame. The molding die of the present invention has a positioning pin to support the lens during the molding. Because the lead frame is aligned with the molding die, the precise alignment between the active device on the lead frame and the lens is not spoiled during the molding.

Optical module with a lens encapsulated within sealant and method for manufacturing the same

A system for editing sheet metal components using a computer, comprising a sheet metal object having graphic element data defining the graphic elements of a sheet metal and connection data defining face data comprising graphic elements and linkage of the faces, wherein the sheet metal object includes a sheet metal edition object corresponding to editing of a sheet metal, e.g., editing of butting or lapping of sheets, and the burden is lessened by automating reformation at the butting or lapping part of the sheet metals.

Method for linking work attribute information, its system and model structure of sheet metal component

An optical module with an arrangement is disclosed in which the module has the LD, the TEC, and the lens with the lens carrier also mounted on the TEC. The signal light from the LD is concentrated by the lens and reflected by the mirror each assembled with the lens carrier mounted on the TEC. The TEC is mounted on the bottom metal that covers the bottom of the ceramic package, the first layer of which is widely cut to set the TEC therein. The FPC is coupled in at least two edges of the first ceramic layer left from the cut.

Optical module with ceramic package reducing optical coupling stress

A method is provided for centrally monitoring machines running at remote customer sites and providing customers with adequate support. The method includes collecting machine operating data, including data for each process stage, at the customer sites, and analyzing, at a central location, the collected machine operating data for each machine. Subsequently, a solution based upon the analysis is proposed to the customer for each of the machines, and the solution is then implemented. The method also includes continuously collecting data to check effectiveness of the installed machines and to verify the solution works.

Customer support system

Customer support system and method of customer support

An optical module capable of suppressing an increase in the number of the components and the complexity of the structure is provided. The optical module has a box package, and a cylindrical sleeve portion extending from a front wall of the package. This sleeve portion has a lens holder holding a lens. The lens holder and the front wall of the package are connected by projection-welding.

Optical module with lens holder projection-welded to butterfly package

The object of the present invention is to provide an optical module for the WDM communication system, in which the oscillation wavelength is on the grid of the WDM regulation, moreover the optical output power and the oscillation wavelength can be controlled independently. The present module comprises a semiconductor light-emitting device, a wedge shaped etalon device and two light-receiving devices. The etalon device contains a first portion, on which the anti-reflection films are coated, and a second portion. One of the receiving devices detects light transmitted through the first portion of the etalon device, while the other device detects light through the second portion. Signal from the former device controls the output power of the light-emitting device, while the signal from the latter receiving device controls the oscillation wavelength of the laser.

Optical module

One object of the present invention is to provide a new arrangement for an optical module that enables to align the optical fiber with the semiconductor optical device in active alignment technique. The optical module of the present invention includes a container, a base and a ferrule assembly. The ferrule assembly integrates the optical fiber, the ferrule and the holder, in which the ferrule secures the optical fiber in a center thereof and the holder having a V-groove secures the ferrule in the V-groove. The container has a depression, one end of which is opened, for receiving the ferrule therein. The semiconductor optical device is mounted on a region opposite to the open of the depression of the container. Both sides of the depression are regions on a primary surface of the container, and, when the holder is placed on these two regions, the ferrule is set within the depression with gaps against side surfaces of the depression. Thus, by sliding the holder on the container, the optical fiber can be actively aligned with the semiconductor optical device mounted on the container in directions parallel to the optical axis and within the primary surface of the container.

The present invention is to provide an optical module in which factors influencing the optical coupling between the semiconductor optical device and the optical fiber may be reduced. The optical module of the present invention includes a ferrule having first and second regions arranged in this order, and an optical fiber secured in the center of the ferrule. The second region of the ferrule provides an end surface of the ferrule, where the tip of the core is exposed thereto, and a mounting surface where the semiconductor optical device is mounted thereon to optically couple with the core of the optical fiber.

Optical module having a semiconductor optical device mounted on a bared cladding of an optical fiber

An optical moduleincludes an optical component, a bodyincorporating an optical element, and a metallic sleevehaving a tubular shape. The optical componentincludes a nonmetallic ferrulehaving an optical fiber insertion hole, and a metallic holderwhich covers part of the ferrule. In this optical module, part of the holderis inserted into the sleeve, and is positioned and welded to the sleeve. The sleeveis positioned to a tubular portionof the bodyand welded thereto.

A method is provided for preparing an estimate for sheet metal working. Data of bending lines and data of an associated processing time for the bending lines is stored. Data of holes and data of an associated processing time for the holes is stored. A three-dimensional view and a development drawing which realizes the three-dimensional view are prepared based on an orthographic drawing. A bending line and a hole on a product are detected based on at least one of data of the three-dimensional view and data of the development drawing. A processing time of the specified bending line is calculated based on the associated data of the bending lines. A processing time of the specified hole on the product is calculated based on the associated data of the holes. The processing time of the bending line and the processing time of the hole are stored in a processing time memory. A total processing time necessary to process the product is calculated by adding up the processing times stored in the processing time memory. The total processing time is converted to a cost of processing the product in consideration of a cost per processing time.

Method of preparing estimate for sheet metal working

Disclosed are an apparatus and a method, which assist CAD data to be usable by supplier's own CAD and automatic programming tool no matter how a format of the CAD data from an orderer may be. Electronic drawing data Dx prepared in an ordereris received in an outsourcing service center, the received electronic drawing data Dx is subjected to data conversion into electronic drawing data Dc in a format designated by the supplier, and the electronic drawing data Dc having been subjected to the data conversion is transmitted to the supplieror a designated destination.

Apparatus for processing electronic drawing data

The light-emitting module includes a semiconductor light-emitting device, a first optical detector for monitoring the magnitude of light emitted from the semiconductor device, a second optical detector for monitoring an oscillation wavelength of the semiconductor device, and an Etalon. The first detector is located in a position where the wavelength variation of the transmitted light from the Etalon is relatively small, while the second detector is located in a position where the wavelength variation of the transmitted light is relatively large. The geometrical size of the second detector along the first direction is wider than that along the second direction normal to the first direction; this thus enhances the efficiency of wavelength sensitivity.

Growing community of inventors

Yokohama, Japan

Toshio Takagi