International Business Machines Corporation

Toshio Sakurai

Hiroyuki Takenoshita

Taichiroh Nomura

Chikashi Hara

Satoru Kumai

Kazuyo Hayakawa

A system for cooling interior and external housing surfaces of an electronic apparatus. The apparatus includes at least one electronic component, a heat transfer mechanism for transferring to an external surface of the apparatus heat generated by the electronic component, and a cooling mechanism for cooling the external surface of the apparatus. The cooling mechanism also includes an airflow generation device and an opening that enables airflow to simultaneously flow over at least one electronic component within the apparatus and over the external surface to dissipate the heat generated by the at least one electronic component.

Growing community of inventors

Amagasaki, Japan

Toshio Sakurai