Sumitomo Electric Industries, Limited

Toshio Nomaguchi

Tetsuya Hattori

Hideki Yagi

Yukihiro Tsuji

Kenji Hiratsuka

Kazunori Fujimoto

An optical module is described, where the optical module installs an optical device whose identification mark is able to be distinguished even after the optical device is installed in the optical module. The identifying mark of the optical device is formed in a position able to be inspected from the direction of the normal line of the light-emitting facet of the optical device. Accordingly, the identifying mark becomes able to be identified through the lens after the optical device is installed in the package of the optical module.

Optical module installing optical device with identifying mark visually inspected after assembly thereof

To grasp a removable particle contamination and appropriately removing a particle contamination exposing from a surface of a semiconductor layer, this production method of the semiconductor optical device includes a surface treatment step in which particle contaminations removed from a surface of a cap layerby etching are limited to particle contaminations A, Chigher than the thickness of a resist layerformed on the surface of the cap layer. Therefore, the heights of removable particle contaminations can be preliminarily grasped based on the thickness of the resist layerformed, whereby the particle contaminations exposing from the surface of the cap layercan be appropriately removed by etching just enough. By repeating steps S-Swhile changing the thickness of the resist layer, it is feasible to prevent unnecessary etching of a wafer and to remove the particle contaminations more completely.

Method for producing semiconductor optical device

A method of producing a semiconductor optical device includes a first step of growing a stacked semiconductor layer including a first III-V group compound semiconductor layer for an active layer on a substrate; a second step of forming a silicon oxide film on the stacked semiconductor layer, the silicon oxide film having a predetermined film stress and a predetermined thickness; a third step of forming a strip-shaped groove in the silicon oxide film by etching the silicon oxide film, using a resist pattern formed on the silicon oxide film, until a surface of the stacked semiconductor layer is exposed; and a fourth step of growing a second III-V group compound semiconductor layer in the groove using the silicon oxide film as a selective mask.

Method of producing semiconductor optical device

In the method of making a semiconductor laser, a semiconductor region is grown on an active layer, and a part of the semiconductor region is etched to form a ridge structure. An insulating film is formed over the ridge structure, and a resin layer of photosensitive material is formed to bury the ridge structure. A cured resin portion and an uncured resin portion are formed in the resin layer by performing lithographic exposure of the resin layer, and the uncured resin portion is on the top of the ridge structure. The uncured resin portion is removed to form a dent which is provided on the top of the ridge structure. An overall surface of the cured resin portion and dent is etched to form an etched resin layer. An opening is formed in the etched resin layer by thinning the cured resin portion, and a part of the insulating film is exposed in the opening of the etched resin layer. The part of the insulating film is etched using the etched resin layer as a mask to form an opening in the insulating film. An electrode is formed over the ridge structure and the etched resin layer.

Semiconductor laser and method of making the same

The present invention provides a semiconductor laser diode prevents not only the adhesion of the upper electrode but the heat dissipation of the mesa from degrading. The laser diode includes a substrate, portion of which forms a mesa including an active layer, an insulating layer formed so as to bury the mesa, and an electrode formed on the mesa and the insulating layer. This insulating layer may be selected from SiO, SiON, SiN, AlOor ZrOand formed by the inductive coupling plasma-enhanced chemical vapor deposition (ICP-CVD) technique.

Method for manufacturing semiconductor optical device using inductive coupled plasma-enhance CVD

A method of producing a semiconductor device, including: a first plasma processing step of processing a surface of a resin layer laid on a semiconductor element and containing silicon, with a first plasma generated from a gas containing oxygen and fluorine, thereby forming an oxide film; and an electrode pad forming step of forming an electrode pad of a metal on the oxide film.

Method of producing a semiconductor device by forming an oxide film on a resin layer

In a method of fabricating a semiconductor optical device, insulating structures for an alignment mark for use in electron beam exposure are formed on a primary surface of a first group III-V semiconductor region. After forming the insulating structures, a second group III-V semiconductor region is grown on the first group III-V semiconductor region to form an epitaxial wafer. The height of the insulating structures is larger than thickness of the second group III-V semiconductor region. After forming the second group III-V semiconductor region, alignment for the electron beam exposure is performed. After the alignment, a resist is exposed to an electron beam to form a resist mask. The resist mask has a pattern for a diffraction grating, and the resist is on the epitaxial wafer.

Method of fabricating semiconductor optical device

This invention provides a semiconductor laser that enables to oscillate at a wavelength defined by a Bragg grating formed therein in a wide temperature range without any temperature-controlling. The semiconductor laser comprises an active region and the Bragg grating formed with the active region. A light-emitting surface and a light-reflecting surface are formed so as to sandwiches the active region. The light-emitting surface has an anti-reflective coating, the reflectivity of which is so adjusted that the minimum thereof is at the wavelength where the gain attributed to the FP modes is the maximum and is smaller than 0.3%.

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Yokohama, Japan

Toshio Nomaguchi