Taiyo Yuden Co., Ltd.

Fujitsu Media Devices Limited

Fujitsu Corporation

Japan Aerospace Exploration Agency

Toshio Nishizawa

Shinji Yamamoto

Motoyuki Tajima

Toshihiko Murata

Hikaru Shimomura

Koichi Sato

Masanori Ueda

Tokihiro Nishihara

Shinji Taniguchi

Shogo Inoue

Osamu Ikata

Hiroaki Kobayashi

Seiichi Mitobe

Go Endo

Yasuyuki Saito

Naoya Yabuuchi

Koichi Hatano

Naoki Kakita

Hiroyuki Furusato

Ryohei Komiyama

Noriaki Taniguchi

Tomoka Hattanda

Kiyohide Misawa

Hiroshi Gotoda

Osamu Kawauchi

Junichi Kazawa

Yuto Hayashi

Takayoshi Hachijo

An acoustic wave device includes a piezoelectric layer, a pair of comb-shaped electrodes disposed on a first surface of the piezoelectric layer, each of the pair of comb-shaped electrodes including electrode fingers that excite an acoustic wave, a support substrate disposed at a second surface side of the piezoelectric layer, and having protruding portions and/or recessed portions on a first surface, which is closer to the piezoelectric layer, of the support substrate, each of the protruding portions and/or the recessed portions having a shape in which each of left and right side surfaces has linear slopes inclined at different angles with respect to the first surface of the piezoelectric layer in a cross-sectional view, and a second insulating layer located between the piezoelectric layer and the support substrate and disposed on the third surface, on which the protruding portions and/or the recessed portions are formed, of the support substrate.

Acoustic wave device, filter, and multiplexer

An acoustic wave device including a support substrate, a piezoelectric layer provided over the support substrate, at least one pair of comb-shaped electrodes disposed on the piezoelectric layer, each of the at least one pair of comb-shaped electrodes including electrode fingers, a temperature compensation film interposed between the support substrate and the piezoelectric layer, the temperature compensation film having a temperature coefficient of elastic constant opposite in sign to a temperature coefficient of elastic constant of the piezoelectric layer; and an insulating layer interposed between the support substrate and the temperature compensation film, a first surface of the insulating layer having first protruding portions and/or first recessed portions, a second surface of the insulating layer having second protruding portions and/or second recessed portions, the first surface being closer to the support substrate, the second surface being closer to the temperature compensation film.

[Object] To observe the sign or occurrence of an unstable operation of a turbo-machine. [Solving Means] An observation apparatusincludes: a detection unitincluding one or two or more sensorsthat are disposed in a turbo-machine, are highly time responsive, and observe unsteady fluctuations of the turbo-machine; a computation unitthat output signals from the one or two or more sensorsevery moment, stores time series data for a predetermined period, and calculates in real time a parameter for detecting an unstable operation of the turbo-machine; and a determination unitthat compares the parameter for detecting the unstable operation with a predetermined threshold and outputs in real time a determination result of a sign or occurrence of the unstable operation.

Observation apparatus, observation method, and non-transitory computer readable medium storing a program

An acoustic wave filter includes: one or more series resonators connected in series between an input terminal and an output terminal; and parallel resonators connected in parallel between the input terminal and the output terminal and formed of piezoelectric thin film resonators, wherein each of at least two resonators of the parallel resonators includes an additional film having island-shaped patterns or aperture patterns formed at equal pitch intervals in a resonance region in which a lower electrode and an upper electrode face each other across a piezoelectric film, and a pitch interval of the island-shaped patterns or the aperture patterns in the additional film included in one of the at least two resonators differs from a pitch interval of the island-shaped patterns or the aperture patterns in the additional film included in another one of the at least two resonators.

Acoustic wave filter, duplexer, and module

An acoustic wave device includes: a substrate; an input terminal that is located on a first surface of the substrate, and to which a high-frequency signal is input; a resonator that is connected to the input terminal, and to which a high-frequency signal input to the input terminal is input; and an insulating layer that is located between the input terminal and the substrate, and has a permittivity smaller than that of the substrate.

Acoustic wave device and fabrication method of the same

An acoustic wave filter includes a piezoelectric substrate, an insulating pattern that has higher thermal conductivity than the piezoelectric substrate formed on the piezoelectric substrate, at least two pads formed on the piezoelectric substrate or the insulating pattern, at least one pad formed on the insulating pattern, at least one acoustic resonator formed on the insulating pattern, and at least one acoustic resonator directly formed on the piezoelectric substrate.

Acoustic wave device

A filter includes: a filter circuit connected between a first terminal and a second terminal; and a matching circuit connected between the filter circuit and the second terminal, wherein an impedance viewed from the second terminal toward the matching circuit is less than an impedance viewed from a node between the filter circuit and the matching circuit toward the filter circuit.

Filter and duplexer

Provided is a duplexer that can maintain isolation characteristics while being able to independently adjust the input/output ground inductances and the common ground inductance of the double-mode filter. The duplexer includes: a transmitting filter; a receiving filter; a package substrate that includes a first substrate, a die attach layer that is patterned onto the first substrate, a second substrate, and an inner layer located between the first substrate and the second substrate; a double-mode filter that constitutes a portion of the receiving filter; a common ground terminal that makes an input ground and an output ground of the double-mode filter commonly grounded, the common ground terminal constituting a portion of the die attach layer; an input-side ground terminal of the double-mode filter, the input-side ground terminal constituting a portion of the inner layer; and an output-side ground terminal of the double-mode filter, the output-side ground terminal constituting a portion of the inner layer and being formed separately from the input-side ground terminal.

Duplexer

A filter includes: a plurality of piezoelectric thin film resonators, each having a multilayered film including a lower electrode located on a substrate, a piezoelectric film located on the lower electrode, and an upper electrode located on the piezoelectric film so as to face the lower electrode, wherein at least two piezoelectric thin film resonators have thick film portions, in each of which the multilayered film is thicker in at least a part of an outer peripheral portion than in an inner portion of a resonance region in which the lower electrode and the upper electrode face each other across the piezoelectric film, and lengths of the thick film portions from edges of the resonance regions are different from each other in the at least two piezoelectric thin film resonators.

A duplexer includes a package substrate having layers stacked, a transmission filter and a reception filter that are provided on an upper surface of a first layer that is one of the layers of the package substrate, the transmission and reception filters being acoustic wave filters, a metal pattern provided on the upper surface of the first layer and formed to surround the transmission and reception filters, a transmission line provided on an upper surface of a second layer that is one of the layers of the package substrate and is positionally lower than the first layer, the transmission line electrically connecting the transmission filter and a transmission terminal together, and a reception line that is provided on the upper surface of the second layer and electrically connects the reception filter and a reception terminal. The thickness of the first layer is greater than that of the second layer.

An acoustic wave device includes an input terminal; a balun that is connected to the input terminal, converts a signal input from the input terminal into two anti-phase signals, and outputs the two anti-phase signals; and a filter that is connected to the balun, and outputs the two anti-phase signals input from the balun as balanced output signals. An output impedance of the balun is equal to an input impedance of the filter, and is larger than an output impedance of the filter.

A balance filter includes a first filter having first multimode surface acoustic wave (SAW) filters connected in parallel, a second filter that is connected to the first filter and includes a second multimode SAW filter, a first terminal connected to the first filter, and second terminals connected to the second filter. An input terminal of the balance filter is one of the first and second terminals, and an output terminal thereof is the other. Electric signals transmitted from the first to second filters or vice versa are in opposite phase. Electric signals are input or output via the second terminals in opposite phase.

Balance filter and duplexer

A surface acoustic wave device includes a supporting substrate, a LiTaO3 piezoelectric substrate joined on the supporting substrate, which has a normal line direction on a main surface thereof in a direction rotated 43&#xb0; to 53&#xb0; from a Y axis to a Z axis direction about an X axis, and an electrode pattern formed on the piezoelectric substrate.

Surface acoustic wave device and duplexer

A surface acoustic wave device having a surface acoustic wave filter having a comb-shaped electrode pattern formed on a piezoelectric element, electrode terminals for inputting and outputting of the surface acoustic wave filter are connected with corresponding electrode patterns of a package through bumps, wherein the comb-shaped electrode pattern has a pair of reflective electrodes, and an input comb-shaped electrode and an output comb-shaped electrode disposed between the pair of reflective electrodes; and an electrode terminal of either the input comb-shaped electrode or an output comb-shaped electrode is disposed such that the electrode terminal is positioned on the side opposite to the side of the other electrode terminal sandwiching a grounded electrode using a routing pattern.

Surface acoustic wave device utilizing a terminal routing pattern

A multimode type SAW filter includes a piezoelectric substrate, and IDT groups formed on the piezoelectric substrate, the IDT groups each having multiple IDTs connected in series in which an input/output electrode and a ground electrode are coupled via a floating conductor. Adjacent electrode fingers between adjacent IDTs among the multiple IDTs of the IDT groups include a first electrode finger connected to the floating conductor in one of the IDT groups and a second electrode finger connected to one of the input/output electrode and the ground electrode in another one of the IDT groups.

Growing community of inventors

Yokohama, Japan

Toshio Nishizawa