Ebara Corporation

Kokusai Denshin Denwa Co., Ltd.

Renesas Technology Corp.

Kokusai Denshin Denwa Kabushiki Kaisha

Mitsubishi Denki Kabushiki Kaisha

Hitachi Device Engineering Co., Ltd.

Synaptics Japan Gk

Synaptics Display Devices Gk

Toshio Mizuno

Itsuki Kobata

Kuniaki Yamaguchi

Naoki Miyamoto

Yoshikazu Yokota

Kazuo Ookado

Takayuki Nakaji

Takatoshi Uchida

Kazuya Endo

Mitsuru Miyazaki

Takuya Inoue

Naoki Toyomura

Tatsuo Watanabe

Hideo Kobayashi

Akira Yamaguchi

Yoshio Takeuchi

Hiroyasu Ishikawa

Takuro Muratani

Masayoshi Ohashi

Michihisa Ohkawa

Seiichiro Sakai

Takashi Nose

Hirobumi Furihata

Takashi Inoue

Tomoatsu Ishibashi

Toshinori Suzuki

Akio Sugiyama

Makoto Miyake

Miho Kobayashi

Yasuhiko Itoh

Yasuhiko Ito

Gunkichi Satoh

Tadashi Fujino

Yosuke Himori

Junpei Sakurai

Erina Baba

An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

Substrate processing apparatus

To perform both buff cleaning of a substrate surface and cleaning of an edge part of the substrate, a cleaning module includes: a rotary table configured to support a circular substrate and have a diameter smaller than a diameter of the substrate; a buff cleaning portion configured to buff clean a front side of the substrate while contacting the front side of the substrate supported by the rotary table; a buff cleaning portion movement mechanism configured to move the buff cleaning portion with respect to the substrate; a buff cleaning portion control mechanism configured to control an operation of the buff cleaning portion movement mechanism; and an edge cleaning portion configured to clean an edge part of the substrate while contacting the edge part of the substrate supported by the rotary table.

Cleaning module, substrate processing apparatus including cleaning module, and cleaning method

The invention simulates polishing amount taking into account pressure concentration that occurs in the vicinity of the edge of a substrate when a small-diameter buffing pad overhangs the substrate to be buffed. One embodiment of the invention provides a method for simulating polishing amount in a case where a polishing pad of a smaller size than a substrate is used to buff the substrate. The method includes measuring distributions of pressure that is applied from the polishing pad to the substrate according to each overhang amount of the polishing pad relative to the substrate by using a pressure sensor, and correcting the pressure that is used in the polishing amount simulation in accordance with the overhang amounts and the measured pressure distributions.

Polishing-amount simulation method for buffing, and buffing apparatus

A buffing module for buffing a substrate is provided. The buffing module comprises a buff table for supporting the substrate, the buff table being rotatable; and a buff head to which a buff pad is attached, being rotatable and movable in a direction of approaching the buff table and a direction of moving away from the buff table. The buff pad includes a first part and a second part arranged so as to surround the first part on an outer side of the first part, the first part and the second part have different characteristics from each other.

Buffing apparatus, and substrate processing apparatus

A buffing apparatus for buffing a substrate is provided. The apparatus includes: a buff table for holding the substrate, the buff table being rotatable; a buff head to which a buff pad for buffing the substrate is attachable, the buff head being rotatable and movable in a direction approaching the buff table and a direction away from the buff table, and an internal supply line for supplying process liquid for the buffing to the substrate being formed inside the buff head; and an external nozzle provided separately through the internal supply line in order to supply the process liquid to the substrate.

Buffing apparatus and substrate processing apparatus

An integrated circuit device includes first and second integrated circuits and a power supply line. The first integrated circuit includes a first power supply circuit, a timing generation circuit generating a synchronization signal, and a first power supply control section. The second integrated circuit includes a second power supply circuit and a second power supply control section. The power supply line electrically connects the outputs of the first and second power supply circuit. The first and second power supply control sections are each configured to start the operations of the first and second power supply circuits, respectively, in response to a start of a supply of the synchronization signal after a sleep-out command is supplied thereto. The timing generation circuit starts supplying the synchronization signal after a predetermined waiting time elapses after the sleep-out command is supplied to the first integrated circuit.

Driver IC of a display panel waiting a predetermined time before supplying vertical synchronization signal (VSYNC) after sleep-out command is received

A display device includes a display panel including a display region and first and second drivers. Feature data indicating feature values of first and second images displayed on first and second portions of the display region are exchanged between the first and second drivers, and the first and second drivers drive the first and second portions of the display region in response to the feature data.

Display device in which feature data are exchanged between drivers

There is to be provided a liquid crystal drive controller with a built-in power supply circuit wherein latch-up is made difficult to arise even if one amplitude level of the segment line drive voltage is set to the ground potential and the levels of other liquid crystal drive voltages are determined accordingly. A semiconductor integrated circuit with a built-in power supply circuit, wherein a negative voltage generated in a power supply circuit is applied to a substrate or a well region as a bias voltage, is provided with a switch for temporarily applying the ground potential to the substrate or well region to be biased with the negative voltage at the time of starting up the power supply circuit.

Semiconductor integrated circuit with voltage generation circuit, liquid crystal display controller and mobile electric equipment

Growing community of inventors

Tokyo, Japan

Toshio Mizuno