Fujitsu Corporation

Toshio Kumai

Yutaka Higashiguchi

Yasushi Kobayashi

Yasuhiro Teshima

Mitsuo Inagaki

Yasuhiro Ichihara

Ryoichi Ochiai

Mamoru Niishiro

Shuzo Igarashi

Takaki Kokubun

Shingo Nojiri

Yukio Sekiya

Takao Shinoda

Makoto Totani

Hiroshi Iimura

Hideaki Tamura

Seishi Chiba

Mitsuru Hamada

Shoji Ishida

An information processing device including a personal authentication function by reading a fingerprint. The device has a detection structure having an improved detection function. The information processing device (mobile telephone device) has a fingerprint read function and a case () having a window (), a fingerprint sensor () arranged in the case and having a sensor surface () exposed to the window, and a frame (electrode) arranged inside or on the case and forming an opening () for exposing the sensor surface of the fingerprint sensor from the window, so that the frame is in contact with a finger through the window of the case.

Information processing device

A semiconductor device includes a wiring board, an electronic component supported by the wiring board, a heat conduction layer provided in the wiring board so as to be in contact with the electronic component, and terminals provided on the wiring board and thermally connected to the heat conduction layer through thermal vias provided in the wiring board. Heat generated by the electronic component conducts to the terminals through the heat conduction layer and then conducts to a circuit board on which the semiconductor device is placed.

Semiconductor device having terminals for heat radiation

A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.

Semiconductor device having a bump which is inspected from outside and a

A semiconductor device includes a package having opposing surfaces, a first terminal for an outer connection supported by said package and electronic components supported by said package, and the opposing surfaces of the package having slits so that a shape of the package can be changed in a mounted state. Therefore, stress applied to soldered junctions of the first and second terminals is decreased.

Semiconductor device and semiconductor device mounting board

A dual in-line packaging comprises a substrate having a top surface, a bottom surface and a peripheral surface, semiconductor chips mounted on the top and bottom surfaces of the substrate, a plurality of terminals fixed to the substrate and projecting from the bottom surface of the substrate, a first layer made of a first material and covering the bottom surface of the substrate and the semiconductor chips, and a second layer made of a second material and covering the top surface of the substrate and the semiconductor chips. The first material is resilient and moisture resistant and the second material is hard compared to the first material.

Dual in-line packaging and method of producing the same

Dual in-line packaging with improved moisture resistance

Magnetic recording media having lubricated contact layer

Growing community of inventors

Kawasaki, Japan

Toshio Kumai