Kansai Paint Company, Ltd.

Mitsubishi Denki Kabushiki Kaisha

Toshio Kondo

Naozumi Iwasawa

Kenji Seko

Yuu Akaki

Osamu Isozaki

Takeshi Tomiyama

Sadaaki Hashimoto

Naoya Haruta

Yoshimasa Kinaga

Yu Akaki

Isao Kobayashi

Shinsuke Onishi

Masahiro Hoshino

A multi-layer application film formed by laminating at least two resin films, a top layer film (I) being formed from a crosslinkable resin coating composition (A), an under layer film (II) being formed from a thermoplastic resin (B), showing practically no stickiness per se, and having a tensile elongation at breakage in the range of 50 to 1000%, said multi-layer application film being applied onto a plastic substrate.

Coated film and method of laminating the same

An improved process for preparing a printed-circuit board, which successively comprises (I) a step of forming a positive photo-sensitive resist film onto a circuit board having a conductive film according to the electrodeposition coating process, (II) a step of irradiating a full dose of an actinic ray onto the positive photo-sensitive resist film through a photomask with which the actinic ray is cut off over a conductive circuit-forming area, (III) a step of developing the resulting resist film, (IV) a step of etching away a deposited copper-clad area, and (V) removing a remaining resist film on the conductive circuit-forming area, the improvement further comprising a step of imparting the resist film in the conductive circuit-forming area an increased alkali resistance prior to development so as to obtain the printed-circuit board having high resolution with good reproductivity without being affected by variations of the developing conditions.

Process for preparing printed-circuit board

Disclosed is an electrodeposition coating composition for use in printed circuit board photo resist, comprising (a) an acrylic resin containing (meth)acryloyl group and obtained by use of diacetone (meth)acrylamide as an essential monomer component, said acrylic resin being a water-soluble or water-dispersible photo-curable unsaturated resin having an acid value of 20 to 300, a degree of unsaturation of 0.2 to 4.5 moles/kg, a number average molecular weight of 1,000 to 100,000 and a glass transition temperature of 0.degree. to 100.degree. C., and (b) a water-insoluble photopolymerization initiator.

Electrodeposition coating composition for use in printed circuit board

A positive-type photosensitive electrodeposition coating composition comprising as a main component a water-soluble or water-dispersible resin containing modified quinonediazidesulfone units represented by the following formula (I) ##STR1## wherein R.sub.1 represents ##STR2## or ##STR3## R.sub.2 represents a hydrogen atom, an alkyl group, a cycloalkyl group or an alkyl ether group, and

Positive-type photosensitive electrodeposition coating composition with

An electrodeposition coating process of a photoresist for printed circuit board which comprises electrodeposition coating on a conductive surface a photosensitive electrodeposition coating composition (A), and thereafter further electrodeposition coating on the resultant coated plate an electrodeposition coating composition (B) composed chiefly of water-soluble or water-dispersible resin having a glass transition temperature (Tg) not lower than 20.degree. C.

Electrodeposition coating process of photoresist for printed circuit

Disclosed is a process for preparing a printed-circuit board, which process comprises the steps of:

Process for preparing a printed-circuit board

A photocurable electrodeposition coating composition for printed circuit photoresist film comprising

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Fujisawa, Japan

Toshio Kondo