Murata Manufacturing Co., Ltd.

Fuji Xerox Co., Ltd.

Toshio Kitagawa

Eiichi Nagatsuka

Yukio Hata

Akito Asakura

Akihiko Ueyama

Masaki Kitagawa

The present invention provide a resistance welding method for solving the problem of breakage of the welded portion by corrosion of an iron-copper alloy layer having a poor corrosion resistance formed at the welding portion, when a first metallic member comprising an iron-based metal is joined to a second metallic member comprising a copper based metal, wherein the problem above is solved by forming a nickel film on at least one surface of the first metallic member comprising the iron-based metal and the second metallic member comprising the copper-based metal to be joined, and by applying resistance welding while the first metallic member is made to butt against the second metallic member, thereby forming the first alloy layer containing nickel, copper and iron at the side of the first metallic member, and the second alloy layer containing nickel and copper at the side of the second metallic member to allow the alloy layers to exhibit an excellent corrosion resistance.

Resistance welding method and structure of resistance welding part, and method for manufacturing electronic component and electronic component

Method for manufacturing electronic component

A coil component and a manufacturing method for producing the same permit a wire terminal to be bonded to an electrode with high reliability by implementing thermal compression bonding using a heater chip. The coil component comprises a bobbin around which a wire is wound, the wire having a solder layer on the outer peripheral surface of a core conductor and an insulating layer formed on the outer peripheral surface of the solder layer. The wire terminal is secured to the electrode provided on the bobbin by thermal compression bonding. A heated heater chip is applied to the terminal to break the insulating layer and to melt the solder layer at substantially the same time. Then, pressure is applied to the heater chip to provide intermetallic bonding between the core conductor and the electrode. Melted solder solidifies and covers the area around the core conductor, thereby securely bonding the wire terminal to the electrode.

Coil component and manufacturing method for the same

Growing community of inventors

Takefu, Japan

Toshio Kitagawa