The Furukawa Electric Co., Ltd.

Mitsui Petrochemical Industries, Ltd.

Yokogawa Electric Corporation

Yokogawa Hokushin Electric Corp.

Other

Nec Corporation

Hoya Corporation

Fitel USA Corporation

Mitsubishi Heavy Industries Machine Tool Co., Ltd.

Yokogawa Electric Works, Ltd.

Max Kabushiki Kaisha

The Furukawa Manufacturing Co., Ltd.

Toshio Kimura

Takeshi Aikiyo

Naoki Tsukiji

Junji Yoshida

Masashi Nakae

Akira Todo

Yuta Ishige

Masayoshi Kurisu

Akinori Toyota

Takeo Shimizu

Takeshi Minoda

Sanehiro Yamamoto

Naoki Hayamizu

Takasi Nakagawa

Jun Miyokawa

Etsuji Katayama

Takahiro Okada

Shu Namiki

Hiroshi Matsuura

Shuichi Nakagawa

Masaki Funabashi

Yuichiro Irie

Maiko Ariga

Tomoaki Toratani

Kazuki Yamaoka

Toshiro Yamamoto

Tetsuya Matsuyama

Tomoya Kato

Masakazu Miura

Shinichiro Iizuka

Mieko Konishi

Teruhiko Tokumo

Shigenobu Miyamoto

Yoshihiro Ogawa

Naoki Kimura

Hiroshi Shimizu

Hiroyuki Yamamoto

Hiroyuki Matsuura

Yoshihiro Emori

Benjamin John Eggleton

Yoshihiro Suzuki

Hiroshi Ichikawa

Yoshihiro Okano

Takashi Shigematsu

Yutaka Ohki

Yohzoh Yamamoto

Yutaka Oki

Hidehiro Taniguchi

Akira Fujisaki

Toshiyuki Hirose

Tetsuya Satoh

Jun Niekawa

Takashi Koseki

Paul Steinvurzel

Hideaki Arisawa

Masahiro Otani

Yusei Shirasaka

Tsuyoshi Wakisaka

Toshio Sugaya

Mamoru Yamaguchi

Masayoshi Seki

Kohei Terada

Tatsuhiko Tanimichi

Yasuo Wako

Ken Matsumura

Hiroshi Otsu

Hiroshi Kotan

Hideaki Yoshizawa

Souko Kado

Kouhei Terada

Sadayoshi Kanamaru

Akira Iketani

Shinji Osato

Akira Fujisakii

A semiconductor laser module includes a semiconductor laser that outputs laser light; an optical fiber that guides the laser light; a lens that couples the laser light, which is output from the semiconductor laser, with the optical fiber; a base that is substantially tabular in shape and that has the semiconductor laser, the optical fiber, and the lens fixed thereon either directly or indirectly; and a housing which houses the base and fixes the base either directly or indirectly. Among faces of the base, a face on a side that is fixed either directly or indirectly to the housing includes a junction plane that is joined to the housing either directly or indirectly, and a detachment plane that is detached to remain unfixed from the housing.

Semiconductor laser module

An optical fiber fixing structure includes: a cylindrical member; an optical fiber inserted into a hole of the cylindrical member; and a fixing material configured to fix the cylindrical member and the optical fiber, wherein the optical fiber is a polarization maintaining optical fiber having a polarization axis, and a center of the optical fiber is arranged so as to be eccentric to a center of the hole, and an angle formed by an eccentric direction connecting the center of the hole and the center of the optical fiber and the polarization axis is &#x2212;22.5&#xb0; to 22.5&#xb0;, or 67.5&#xb0; to 112.5&#xb0;.

Optical fiber fixing structure

Semiconductor lasers are arranged in a plurality of columns. The columns of the respective semiconductor lasers include semiconductor laser installed columns. Reflecting mirrors in the respective semiconductor laser installed columns reflect light in substantially the same axial direction as viewed from above, and constitute beam groups. The beam groups of the respective semiconductor laser installed columns are formed on both sides in a width direction of a housing. That is, the beam groups are configured for each of the semiconductor laser installed columns, and the respective beam groups are formed on mutually different axes as viewed from above.

Semiconductor laser module and semiconductor laser module manufacturing method

A semiconductor laser module includes a package; a plurality of semiconductor laser elements provided in the package; a member having a plurality of mounting surfaces on which the semiconductor laser elements are mounted, the mounting surfaces being separated from a bottom surface of the package by respective distances, the distances being gradually different from each other in a manner that the mounting surfaces as a whole form a step-like form; a plurality of lenses collimating respective laser beams emitted from the semiconductor laser elements; a plurality of reflection mirrors reflecting the respective laser beams; a condenser lens unit condensing the laser beams; an optical fiber where the optical beams condensed by the condenser lenses are optically coupled; and an optical filter disposed on optical lines of the respective laser beams reflected by the reflection mirrors and reflecting light having wavelengths different from the wavelengths of the laser beams.

A semiconductor laser module includes a semiconductor laser element outputting a laser light; an optical fiber; an optical component disposed at an outer periphery of the optical fiber and fixing the optical fiber; a first-fixing agent fastening the optical component and the optical fiber; a light-absorbing element disposed at an outer periphery of the optical component and fixing the optical component; a first light-blocking portion disposed between an end into which the laser light is incident of the optical fiber and the optical component; and a housing accommodating therein the semiconductor laser element, an end into which the laser light is incident of the optical fiber and the first light-blocking portion. The optical component has an optical transmittance at a wavelength of the laser light, and the light-absorbing element has an optical absorptivity at a wavelength of the laser light.

A semiconductor laser module includes: a semiconductor laser element emitting a laser light; an optical fiber, into which the laser light emitted from the semiconductor laser element is incident, guiding the laser light; and an optical-fiber-holding unit having a fixing agent and holding the optical fiber, the fixing agent being for fixing the optical fiber. The fixing agent is provided at an area in which a power of a leakage light of the laser light having been incident into the optical fiber and then emitted to outside the optical fiber is low.

An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.

Optical element module

A semiconductor laser moduleis mainly composed of a package, a semiconductor laser, lenses, reflecting mirrors, an optical fiber, and the like. The packageis composed of a bottom part and side surfaces. The side surfacesstand erect approximately vertical to the bottom part of the package. In the semiconductor laser module, a plurality of semiconductor laser installation surfacesare formed in a step-like shape. On each semiconductor laser installation surface, a semiconductor laseris installed. A lensis arranged at the anterior (in the emission direction) of the semiconductor laser. Moreover, a lensis arranged further to the anterior. A reflecting mirroris fixed to the side surface, which is provided facing the emission direction of the semiconductor laser.

Provided is a grindstone tool capable of grinding with high precision and a method for manufacturing same, the grindstone tool having improved chip discharge characteristics to thereby prevent chips clogging of the chip pocket. The grinding tool comprises: dimples () formed in the external peripheral surface () of a base metal () so that the quantity present in any position in the width direction of the external peripheral surface () is the same in the peripheral direction; a grinding surface () formed by affixing a plurality of abrasive grains () to the external peripheral surface () using a plating layer (); and recess parts () into which chips produced by the grinding of the abrasive grains () are discharged, the recess parts being formed by portions that correspond to the dimples () in the grinding surface () being recessed.

Grindstone tool and method for manufacturing same

[Objective] To restrict degradation of optical characteristics due to a resin adhesive containing an inorganic filler. [Means] The width d of a lens bodyand the height of an inorganic fillerin a direction orthogonal to the surface of a substrate are set such that an inclination angle of a collimating lensdoes not exceed a maximum tolerable inclination angle when the inorganic filleris positioned near the width-wise center of the lens body. As a result, even when the inorganic filleris inserted between the bottom surface of the collimating lensand the top surface of the substrate, degradation of the optical characteristics of the laser module including skewing of the optical axis of the laser light and distortion of the beam shape of the laser light can be restricted.

Laser module

A semiconductor laser module has a semiconductor laser device; a package for housing the semiconductor laser device; a PBC fixed in the package for polarization-synthesizing two laser beams output from the semiconductor laser device; a depolarizing element fixed in the package for depolarizing a synthesizing light output from the PBC; and an optical fiber for receiving a light output from the depolarizing element.

Semiconductor laser module, optical amplifier, and method of manufacturing the semiconductor laser module

A method of aligning an optical fiber according to the present invention has a first step of aligning an optical fiber by moving the optical fiber and finding a position that maximizes the power of beam outputted from the optical fiber with the use of a power meter, and a second step of moving and aligning the optical fiber in the optical axis direction (direction Z) from the position in which the optical fiber has been as a result of the alignment in the first step in a manner that makes the degree of polarization of two laser beams Kand Kequal to or lower than a given level with the use of a polarimeter.

Method of aligning an optical fiber, method of manufacturing a semiconductor laser module, and semiconductor laser module

A semiconductor laser module according to the present invention includes a polarization-synthesizing module having a polarization-synthesizing means configured to polarization synthesize two laser beams and a holder member for holding the polarization-synthesizing means with an approximately cylindrical circumferential surface, and a supporting member for supporting the holder member at least to rotate about an central axis and fixing the holder member at a predetermined position.

Semiconductor laser module and method of manufacturing the same

The object of the invention is to secure straight travelability for a fastener during the driving of the latter, simplify the connecting fastener production process, simplify the cleaning of the work site, and prevent work-attending damage to the flooring. In a connecting fastener, kraft paper () in a combination band () for holding a number of nails () is pasted to opposite surfaces of the nails (), the kraft paper () having a plastic layer () that is formed with a plurality of grooves (A,B) with a pitch smaller than the arrangement pitch of the nails (), facilitating the separation of the nails ().

Connected fastener having separation facilitator

Growing community of inventors

Tokyo, Japan

Toshio Kimura