Dainippon Screen Mfg. Co., Ltd.

Toshio Hiroe

Yoshitaka Abiko

Kenji Sugimoto

Koji Hasegawa

Tadashi Maegawa

Ichiro Mitsuyoshi

Hideki Hayashi

Tomonori Kojimaru

Katsuhiro Fukui

Akira Morita

Yoshihiro Nishina

Keiji Magara

Hiroaki Uchida

Akihiko Hidaka

A substrate processing apparatus of the present invention is to apply processing using a processing liquid to a substrate. The substrate processing apparatus includes a first-side plate disposed oppositely to a first surface of the substrate with a distance and provided with plural discharge ports and suction ports in a surface opposing the first surface, a first-side processing liquid supply mechanism that supplies a processing liquid to the discharge ports in the first-side plate, and a first-side suction mechanism that sucks insides of the suction ports in the first-side plate.

Substrate processing apparatus

In a substrate processing apparatus of the present invention, when substrates are loaded into a chamber, a frame part formed integral with a substrate holding part is interposed between the chamber and a cover, thereby sealing the interior of the chamber. When the substrates are unloaded to above the chamber, the chamber and the cover are brought into a direct contact, thereby sealing the interior of the chamber. Hence, the interior of the chamber can be sealed satisfactorily when the substrates are loaded into the chamber, and when the substrates are unloaded to above the chamber.

Substrate processing apparatus and substrate processing method

A substrate processing apparatus performs a chemical solution process in a chemical solution process room that is partially formed within a chamber. During the chemical solution process, the substrate processing apparatus seals the chemical solution process room, and measures the pressure within the chemical solution process room, and controls the pressure within the chemical solution process room, based on a measured value. Irrespective of location environment of the substrate processing apparatus, the chemical solution process room can be controlled to a predetermined pressure. The substrate processing apparatus also permits efficient pressure control with respect to a minimum required amount of region.

A substrate treating apparatus for treating substrates having a film coating. The apparatus includes a treating unit for treating the substrates with a treating solution, a drain pipe for draining the treating solution from the treating unit, a filter mounted on the drain pipe, and an ultraviolet emitting unit for the filter for emitting ultraviolet light to the treating solution flowing through the filter.

Substrate treating apparatus

A substrate treating apparatus for treating substrates includes a treating tank for receiving and treating the substrates, a holding device movable, while holding the substrates in a cantilever mode, between a treating position in the treating tank and a transfer position above the treating tank, a transport device for supporting the substrates and transferring the substrates to and from the holding device in the transfer position, a detecting device for detecting a posture variation of the holding device, and a correcting device for correcting a position of the holding device or the transport device. The correcting device performs a correction according to the posture variation of the holding device detected by the detecting device in time of transfer of the substrates between the holding device and the transport device.

A substrate treating apparatus for performing a predetermined treatment of substrates includes a treating tank for storing a treating solution, a holder for holding a plurality of substrates arranged in one direction inside the treating tank, and a bubble generating device for generating bubbles in the treating solution stored in the treating tank. The bubble generating device includes a plurality of cylindrical bodies extending in the one direction and arranged in a direction perpendicular to the one direction. Each of the cylindrical bodies is at least partly formed of a porous member extending in the one direction.

For processing semiconductor substrates in a processing fluid, the substrates are introduced into a processing bath in which the processing fluid is filled. For holding the substrates in the process of introducing them into the processing bath, a holder having a pair of holding rods end a pair of aiding rods is prepared. A periodical linear array of grooves is formed on each rod. The rims of substrates are inserted into respective corresponding grooves on the rods so that the substrates do not touch respective side walls of the grooves in the aiding rod.

Apparatus for dipping substrates in processing fluid

A dipping type wafer treatment apparatus includes housing having first and second openings, a wafer treatment bath provided inside the housing, a clean air unit for producing a downflow, a flow rectifier for introducing the downflow into the housing, a communicating chamber provided below the housing being partitioned from a space inside the housing, a duct for guiding mist in the vicinity of the treatment bath in the housing into the communicating chamber together with the downflow, and a pump for forcing air out of the communicating chamber from an air outlet provided in the communicating chamber.

Growing community of inventors

Kyoto, Japan

Toshio Hiroe